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MCHC11F1CFNE2R

NXP Semiconductors

MCHC11F1CFNE2R by NXP Semiconductors

The NXP Semiconductors MCHC11F1CFNE2R microcontroller features 8-bit architecture, 16-bit address bus, and operates at a max clock frequency of 8 MHz. Ideal for industrial applications, it has a temperature range from -40 to 85°C and offers 54 I/O lines for versatile connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

MCHC11F1CFNE2R by NXP Semiconductors
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Digiode

USA . 4,160 parts In-Stock

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4,160

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Anansix

USA . 2,540 parts In-Stock

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2,540

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Flip Electronics

USA . 804 parts In-Stock

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804

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Vyrian

USA . 679 parts In-Stock

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679

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Chip Stock

USA . 297 parts In-Stock

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297

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,499 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 866 parts In-Stock

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$12.234

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One Stop Electronics

USA . 2,752 parts In-Stock

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$33.000

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Microchip USA

USA . 481 parts In-Stock

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$85.570

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481

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UNI Independent Distributors

Spain . 8,342 parts In-Stock

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Argo Parts USA

USA . 4,666 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,514 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Bastille Electronics

Australia . 750 parts In-Stock

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750

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Continental Prestige Electronics

USA . 526 parts In-Stock

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526

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Corphita

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Overview

Unlock unparalleled efficiency and performance with the MCHC11F1CFNE2R by NXP Semiconductors. Crafted with precision and expertise, this microcontroller offers cutting-edge technology and a wide array of applications. From industrial automation to consumer electronics, this product provides seamless integration and unmatched reliability. Elevate your projects with the value and benefits that this top-tier microcontroller brings to the table. Experience innovation like never before with the MCHC11F1CFNE2R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the microcontroller, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

Allows for flexibility in power supply options while still staying within safe operating limits.

Address Bus Width: 16

Enables the microcontroller to access a larger memory space, enhancing its processing capabilities.

Package Shape: SQUARE

Provides a compact and streamlined form factor for the microcontroller, making it easier to integrate into various electronic devices.

Bit Size: 8

Suitable for handling basic computing tasks efficiently and effectively.

No. of Terminals: 68

Offers a sufficient number of connections for interfacing with other components and peripherals in a system.

Package Style (Meter): CHIP CARRIER

Facilitates heat dissipation and electrical connections, enhancing the overall performance and reliability of the microcontroller.

Minimum Supply Voltage: 4.75 V

Ensures stable operation even under low voltage conditions, improving overall system reliability.

Maximum Operating Temperature: 85 °C

Allows the microcontroller to function in a wide range of environmental conditions without overheating or performance degradation.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in extreme cold conditions, making the microcontroller suitable for various applications and environments.

Terminal Finish: TIN

Provides a durable and corrosion-resistant finish for the terminals, ensuring long-term reliability and connectivity.

ADC Channels: YES

Enables the microcontroller to convert analog signals into digital data, expanding its versatility and functionality.

Terminal Position: QUAD

Allows for easy and efficient placement of the microcontroller on a circuit board, simplifying the assembly process.

Width: 24.23 mm

Compact size makes it suitable for applications with space constraints or where a smaller footprint is desired.

External Data Bus Width: 8

Matches the bit size of the microcontroller, ensuring efficient data transfer and processing capabilities.

Maximum Clock Frequency: 8 MHz

Provides high-speed processing capabilities for applications that require fast and responsive performance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures stable and reliable soldering during manufacturing or rework processes.

Peak Reflow Temperature °C: 250

Withstands high reflow temperatures, ensuring the integrity of the solder joints and overall mechanical stability.

Length: 24.23 mm

Compact size and matching width make it easy to design and integrate into various electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications that require robust and reliable performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for controlling various functions and processes within electronic systems, offering versatility and flexibility.

Technology: CMOS

Efficient and low-power technology that enables the microcontroller to operate with minimal power consumption while maintaining high performance.

Terminal Form: J BEND

Facilitates easy and secure connections with external components and eliminates the need for additional mounting hardware.

Nominal Supply Voltage: 5 V

Standard voltage level that is commonly used in many electronic systems, ensuring compatibility and ease of integration.

Terminal Pitch: 1.27 mm

Optimal pitch distance for terminals that allows for reliable connections and efficient circuit board layout.

Moisture Sensitivity Level (MSL): 3

Indicates the microcontroller's resistance to moisture during storage and handling, ensuring long-term reliability and performance.

Speed: 2 rpm

Suitable for applications that require precise timing or synchronization capabilities.

No. of I/O Lines: 54

Offers a sufficient number of input/output lines for interfacing with external devices and peripherals, enhancing system connectivity and functionality.

Technical Specifications

Microcontrollers MCHC11F1CFNE2R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e3

Length:

24.23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

250

Speed:

2 rpm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

MCHC11F1CFNE2R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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