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MCHC11F1CFNE3

NXP Semiconductors

MCHC11F1CFNE3 by NXP Semiconductors

NXP Semiconductors' MCHC11F1CFNE3 microcontroller features 8-bit size, 16-bit address bus width, and 12 MHz max clock frequency. Ideal for industrial applications requiring a CMOS technology-based peripheral IC with EEPROM ROM programmability. Package style is chip carrier with 68 terminals in a square shape.

Median Price

$17.187

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

MCHC11F1CFNE3 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 948 parts In-Stock

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$17.187

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948

$17.187

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Verical

USA . 948 parts In-Stock

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$17.187

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948

$17.187

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Flip Electronics (Authorized)

USA . 6,430 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$17.392

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100

$17.392

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Vyrian

USA . 5,580 parts In-Stock

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5,580

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Bristol Electronics

USA . 3,624 parts In-Stock

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3,624

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Chip Stock

USA . 1,025 parts In-Stock

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1,025

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Anansix

USA . 768 parts In-Stock

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768

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Digiode

USA . 639 parts In-Stock

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639

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Flip Electronics

USA . 486 parts In-Stock

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486

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,044 parts In-Stock

1+ parts

$17.122

100+ parts

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$16.780

6,044

$17.122

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$16.780

One Stop Electronics

USA . 6,078 parts In-Stock

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$23.000

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6,078

$23.000

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Ampacity Inc.

Singapore . 5,940 parts In-Stock

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$32.000

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$32.000

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Semicontronic

India . 6,250 parts In-Stock

1+ parts

$35.000

100+ parts

$34.125

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$33.950

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$35.000

$34.125

$33.950

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Corohmni

South Africa . 588 parts In-Stock

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$36.672

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588

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Aztec Data Supply Inc.

USA . 4,094 parts In-Stock

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$60.610

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4,094

$60.610

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Microchip USA

USA . 318 parts In-Stock

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$131.294

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318

$131.294

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 4,815 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,808 parts In-Stock

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Argo Parts USA

USA . 4,015 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$17.045

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$16.523

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$16.175

1,000

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$16.523

$16.175

Futuretech Components

Singapore . 404 parts In-Stock

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404

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iodParts Technologies Inc.

India . 350 parts In-Stock

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350

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GreenTree Electronics

Israel . 239 parts In-Stock

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239

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Corphita

USA . 71 parts In-Stock

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Overview

Unleash the power of innovation with the MCHC11F1CFNE3 microcontroller by NXP Semiconductors. Designed with cutting-edge technology and superior quality, this product offers endless possibilities for a wide range of applications. From automotive to industrial, this microcontroller delivers unmatched performance and reliability. Experience seamless integration and enhanced functionality with the MCHC11F1CFNE3, setting new standards in the industry. Elevate your projects and stay ahead of the curve with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it a suitable choice for various applications.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows for analog inputs to be converted to digital signals, providing versatility in data acquisition and processing.

Maximum Clock Frequency: 12 MHz

The high clock frequency enables fast processing speeds, making the microcontroller efficient in handling complex tasks and real-time applications.

ROM Programmability: EEPROM

The Electrically Erasable Programmable Read-Only Memory (EEPROM) allows for easy reprogramming and updating of the microcontroller's firmware, enhancing flexibility in application development.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range ensures reliable operation in harsh environmental conditions, making this microcontroller suitable for industrial automation and control systems.

Technical Specifications

Microcontrollers MCHC11F1CFNE3 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e3

Length:

24.2062 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

250

ROM Programmability:

EEPROM

Maximum Seated Height:

4.572 mm

Speed:

3 rpm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.2062 mm

Peripheral IC Type:

Trade Compliance

MCHC11F1CFNE3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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