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MC92500ZQ

NXP Semiconductors

MC92500ZQ by NXP Semiconductors

ATM/SONET/SDH NETWORK INTERFACE; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA256,20X20,50;

Median Price

-

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

LIBRA Elektronik GmbH

Germany . 10,107 parts In-Stock

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Vyrian

USA . 3,441 parts In-Stock

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3,441

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Anansix

USA . 1,867 parts In-Stock

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1,867

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Digiode

USA . 1,113 parts In-Stock

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1,113

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Speed Components Ltd

Israel . 600 parts In-Stock

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600

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Legend Electronics Inc.

USA . 249 parts In-Stock

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249

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ComSIT Distribution GmbH

Germany . 193 parts In-Stock

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193

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Odintec Ltd.

Israel . 45 parts In-Stock

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45

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Electronics Depot

USA . 16 parts In-Stock

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16

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Prism Electronics

USA . 13 parts In-Stock

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13

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 779 parts In-Stock

1+ parts

$530.000

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779

$530.000

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Kepictronics

USA . 4,200 parts In-Stock

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4,200

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UNI Independent Distributors

Spain . 3,414 parts In-Stock

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Corphita

USA . 1,060 parts In-Stock

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1,060

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Perfect Parts

USA . 15 parts In-Stock

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Technical Specifications

ATM/SONET/SDH Circuits MC92500ZQ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from NXP Semiconductors

Specs

Applications:

ATM;SONET

JESD-30 Code:

S-PBGA-B256

Length:

27 mm

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.834 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Trade Compliance

MC92500ZQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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