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MAX4927ETN+T

Analog Devices

MAX4927ETN+T by Analog Devices

MAX4927ETN+T by Analog Devices is a 56-terminal ATM/SONET/SDH circuit with BICMOS technology. Operating b/w -40 to 85 °C, it has a terminal pitch of 0.5mm and nominal voltage of 3.3V. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

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MAX4927ETN+T by Analog Devices
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Analog Devices Inc

USA . 22,500 parts In-Stock

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22,500

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Vyrian

USA . 2,578 parts In-Stock

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Digiode

USA . 2,046 parts In-Stock

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Anansix

USA . 183 parts In-Stock

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MARBEL Systems

Belgium . 254 parts In-Stock

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$11.434

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254

$11.434

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Texas Native Microelectronics

USA . 1,193 parts In-Stock

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$13.143

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$12.617

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$12.223

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$11.566

1,193

$13.143

$12.617

$12.223

$11.566

Kenton Components

USA . 1,003 parts In-Stock

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$15.772

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$13.879

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$15.772

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$13.879

Qasali Group International

UK . 717 parts In-Stock

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$35.486

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$33.002

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$31.228

717

$35.486

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$33.002

$31.228

Semicontronic

India . 14,932 parts In-Stock

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$724.000

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$705.900

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$702.280

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14,932

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Microchip USA

USA . 2,671 parts In-Stock

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Kepictronics

USA . 2,521 parts In-Stock

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Corphita

USA . 1,088 parts In-Stock

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1,088

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the MAX4927ETN+T by Analog Devices, a leader in innovative semiconductor solutions. This ATM/SONET/SDH circuit offers cutting-edge technology in a compact, surface-mount package, making it ideal for a wide range of applications. With industrial-grade temperature tolerance and a no-lead terminal form, this chip delivers exceptional quality and longevity. Trust Analog Devices to deliver superior products that provide unmatched value and benefits to customers looking for top-of-the-line solutions in the industry.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost in manufacturing.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate this product into various electronic devices and systems.

No. of Terminals: 56

With a large number of terminals, this product can support complex circuit configurations and connections.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This combination of package styles allows for efficient heat dissipation and a compact design, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in harsh cold environments without performance degradation.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good conductivity and corrosion resistance, ensuring long-lasting performance.

Terminal Position: QUAD

Quad terminal position allows for efficient routing and connection of signals, enhancing overall circuit performance.

Maximum Seated Height: 0.8 mm

Low maximum seated height enables a compact design and easy integration into small electronic devices.

Width: 5 mm

Narrow width makes this product suitable for applications where board space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes the risk of thermal damage during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and robust connections in assembly.

Length: 11 mm

Medium length provides a balance between compactness and ease of handling during installation.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in demanding environments.

Technology: BICMOS

BICMOS technology offers a good balance between speed and power efficiency for high-performance circuits.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces potential health risks during manufacturing and disposal.

Nominal Supply Voltage: 3.3 V

Optimal nominal supply voltage for compatibility with standard electronic systems and devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and efficient signal routing.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this product can withstand standard moisture exposure during handling and storage.

Technical Specifications

ATM/SONET/SDH Circuits MAX4927ETN+T attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

JESD-30 Code:

R-XQCC-N56

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX4927ETN+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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