Loading...

MC10XSD200FK

NXP Semiconductors

MC10XSD200FK by NXP Semiconductors

MC10XSD200FK by NXP Semiconductors is a BICMOS technology peripheral driver with 23 terminals, operating at -40 to 125 °C. It supports power supplies of 3.3/5,8/36V and is ideal for automotive applications requiring buffer or inverter-based interface ICs in surface-mount chip carrier packages.

Median Price

$8.545

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

MC10XSD200FK by NXP Semiconductors
Compare Share

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 840 parts In-Stock

1+ parts

$8.510

100+ parts

$6.364

1k+ parts

$5.542

10k+ parts

$4.827

840

$8.510

$6.364

$5.542

$4.827

Rochester

USA . 22 parts In-Stock

1+ parts

-

100+ parts

$8.580

1k+ parts

$7.680

10k+ parts

$7.220

22

-

$8.580

$7.680

$7.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 586 parts In-Stock

1+ parts

$9.054

100+ parts

-

1k+ parts

-

10k+ parts

-

586

$9.054

-

-

-

Vyrian

USA . 2,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,138

-

-

-

-

Anansix

USA . 245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

245

-

-

-

-

DigiKey Marketplace

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Nova Conductors

Japan . 37 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 219 parts In-Stock

1+ parts

$2.503

100+ parts

-

1k+ parts

-

10k+ parts

-

219

$2.503

-

-

-

Microchip USA

USA . 263 parts In-Stock

1+ parts

$6.920

100+ parts

$6.920

1k+ parts

$6.920

10k+ parts

$6.920

263

$6.920

$6.920

$6.920

$6.920

One Stop Electronics

USA . 50 parts In-Stock

1+ parts

$8.100

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$8.100

-

-

-

Ampacity Inc.

Singapore . 50 parts In-Stock

1+ parts

$8.100

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$8.100

-

-

-

Corphita

USA . 81 parts In-Stock

1+ parts

$8.577

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$8.577

-

-

-

Component Stockers USA

USA . 85 parts In-Stock

1+ parts

$10.700

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$10.700

-

-

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Argo Parts USA

USA . 4,353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,353

-

-

-

-

Continental Prestige Electronics

USA . 2,693 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,693

-

-

-

-

UNI Independent Distributors

Spain . 2,593 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,593

-

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Perfect Parts

USA . 376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

376

-

-

-

-

Overview

Experience seamless performance with the MC10XSD200FK by NXP Semiconductors, a cutting-edge peripheral driver designed to meet your diverse application needs. Crafted with precision and innovation, this product offers unparalleled reliability and efficiency. Whether you're in the automotive industry or working on industrial projects, this versatile chip carrier ensures optimal performance in extreme temperatures. Trust NXP Semiconductors to deliver high-quality solutions that drive success in all your endeavors. Unlock the potential of your designs with the MC10XSD200FK - where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the peripheral driver, making it suitable for various applications.

Surface Mount: YES

Allows for easy and secure attachment to PCBs, saving time and effort during assembly.

Power Supplies (V): 3.3/5,8/36

Offers flexibility in power input options, making it compatible with a wide range of electronic devices.

No. of Terminals: 23

Provides ample connectivity options for interfacing with other components in a system.

Package Style (Meter): CHIP CARRIER

Enhances thermal conductivity and electrical performance, ensuring reliable operation under varying conditions.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for demanding industrial or automotive environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, expanding its usability in various applications.

Terminal Position: QUAD

Facilitates easy installation and wiring, optimizing the overall system design.

Maximum Time At Peak Reflow Temperature (s): 40

Safely endures reflow processes during manufacturing, ensuring product reliability and quality.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly, maintaining structural integrity and performance.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications, meeting industry standards for electronic components used in vehicles.

Technology: BICMOS

Combines the benefits of bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: NO LEAD

Eliminates the risk of lead-related hazards, meeting environmental regulations and safety standards.

Driver No. of Bits: 2

Provides efficient data processing and signal conditioning for connected peripherals or devices.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage, ensuring long-term reliability in humid or damp environments.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface options for buffer and inverter applications, enhancing compatibility with different systems.

Technical Specifications

Peripheral Drivers MC10XSD200FK attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Driver No. of Bits:

2

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

23

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC23(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,8/36

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC10XSD200FK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20