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MC10XS3425EK

NXP Semiconductors

MC10XS3425EK by NXP Semiconductors

MC10XS3425EK by NXP Semiconductors is a 32-terminal peripheral driver with power supplies of 3.3/5,6/20V. It operates in automotive-grade temperatures (-40 to 125°C) and has a peak reflow temperature of 260°C. This IC type is ideal for buffer or inverter-based applications requiring a small outline package style.

Median Price

$5.400

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,134 parts In-Stock

1+ parts

$5.400

100+ parts

$5.080

1k+ parts

$4.590

10k+ parts

-

1,134

$5.400

$5.080

$4.590

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,435 parts In-Stock

1+ parts

$5.130

100+ parts

-

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3,435

$5.130

-

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Anansix

USA . 2,789 parts In-Stock

1+ parts

-

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2,789

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Vyrian

USA . 913 parts In-Stock

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913

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

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1k+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,266 parts In-Stock

1+ parts

$2.616

100+ parts

-

1k+ parts

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4,266

$2.616

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-

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One Stop Electronics

USA . 937 parts In-Stock

1+ parts

$4.590

100+ parts

-

1k+ parts

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937

$4.590

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Ampacity Inc.

Singapore . 889 parts In-Stock

1+ parts

$4.590

100+ parts

-

1k+ parts

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889

$4.590

-

-

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Semicontronic

India . 833 parts In-Stock

1+ parts

$4.590

100+ parts

$4.475

1k+ parts

$4.452

10k+ parts

-

833

$4.590

$4.475

$4.452

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Corphita

USA . 4,296 parts In-Stock

1+ parts

$4.860

100+ parts

-

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4,296

$4.860

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Corohmni

South Africa . 161 parts In-Stock

1+ parts

$5.946

100+ parts

-

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161

$5.946

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Microchip USA

USA . 171 parts In-Stock

1+ parts

$7.029

100+ parts

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171

$7.029

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UNI Independent Distributors

Spain . 7,780 parts In-Stock

1+ parts

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7,780

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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Continental Prestige Electronics

USA . 3,498 parts In-Stock

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3,498

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Argo Parts USA

USA . 2,838 parts In-Stock

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2,838

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Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

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500

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

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300

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Perfect Parts

USA . 28 parts In-Stock

1+ parts

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100+ parts

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28

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Overview

Enhance your automotive electronics with the MC10XS3425EK from NXP Semiconductors, a leading manufacturer known for quality and innovation. This peripheral driver offers unparalleled performance and reliability, making it ideal for a wide range of applications. With its advanced features and high temperature grade, this product ensures optimal functionality and efficiency. Upgrade your systems with the MC10XS3425EK and experience the value and benefits that only NXP Semiconductors can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving time during assembly.

Power Supplies (V): 3.3/5,6/20

Supports a wide range of power supply voltages, making it versatile and compatible with various systems.

No. of Terminals: 32

Offers a sufficient number of terminals for connecting to other components, enabling comprehensive functionality.

Maximum Operating Temperature: 125 °C

Allows for reliable operation even in high temperature environments, ensuring consistent performance.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, making it suitable for use in harsh environments.

Terminal Finish: TIN

Provides corrosion resistance and efficient electrical conductivity for the terminals.

Peak Reflow Temperature °C: 260

Withstands high temperatures during reflow soldering processes, ensuring secure connections.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for temperature resistance and reliability, making it suitable for automotive applications.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring durability in humid conditions.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Offers versatility in interfacing with other ICs, allowing for seamless integration into various systems.

Technical Specifications

Peripheral Drivers MC10XS3425EK attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,6/20

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC10XS3425EK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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