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MC10XS3425EKR2

NXP Semiconductors

MC10XS3425EKR2 by NXP Semiconductors

MC10XS3425EKR2 by NXP Semiconductors is a 32-terminal peripheral driver with power supplies of 3.3/5,6/20V. It operates in automotive-grade temperatures (-40 to 125°C) and has a peak reflow temperature of 260°C. This IC type is ideal for buffer or inverter-based applications in the automotive industry due to its small outline package and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,827 parts In-Stock

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3,827

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Anansix

USA . 1,710 parts In-Stock

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1,710

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Vyrian

USA . 543 parts In-Stock

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543

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Nova Conductors

Japan . 70 parts In-Stock

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70

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Distributors (Availability)

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Semicontronic

India . 381 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

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$3.395

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381

$3.500

$3.412

$3.395

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Microchip USA

USA . 307 parts In-Stock

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$7.604

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307

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Corohmni

South Africa . 480 parts In-Stock

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$10.778

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480

$10.778

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Aztec Data Supply Inc.

USA . 3,611 parts In-Stock

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$11.432

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$11.432

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AZTECH Wire

Italy . 888 parts In-Stock

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$17.214

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888

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One Stop Electronics

USA . 1,742 parts In-Stock

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$30.500

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$30.500

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Ampacity Inc.

Singapore . 1,411 parts In-Stock

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$49.500

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$49.500

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Corphita

USA . 4,765 parts In-Stock

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4,765

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Argo Parts USA

USA . 2,685 parts In-Stock

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2,685

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Continental Prestige Electronics

USA . 2,337 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,040 parts In-Stock

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UNI Independent Distributors

Spain . 1,390 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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450

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Discover the MC10XS3425EKR2 by NXP Semiconductors, a top-quality peripheral driver designed for automotive applications. With its reliable performance and durable construction, this product is sure to exceed your expectations. The MC10XS3425EKR2 offers unmatched value and benefits, making it the ideal choice for your next project. Trust NXP Semiconductors for innovative solutions that deliver superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient PCB assembly, saving time and effort during manufacturing.

Power Supplies (V): 3.3/5,6/20

The multiple power supply options cater to different voltage requirements, enhancing the versatility and compatibility of the product.

No. of Terminals: 32

With a higher number of terminals, the peripheral driver can accommodate more connections and provide greater functionality in a single device.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the peripheral driver can withstand harsh environmental conditions without compromising performance.

Terminal Finish: TIN

The use of tin as a terminal finish provides good solderability, ensuring reliable electrical connections during installation.

Moisture Sensitivity Level (MSL): 3

This MSL level indicates that the product can withstand multiple heat cycling conditions, making it suitable for a wide range of applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The versatile interface IC type allows for flexible usage and integration with different systems, making it a highly adaptable peripheral driver.

Technical Specifications

Peripheral Drivers MC10XS3425EKR2 attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,6/20

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC10XS3425EKR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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