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MB2245BB-T

NXP Semiconductors

MB2245BB-T by NXP Semiconductors

MB2245BB-T by NXP Semiconductors is a versatile 8-bit bus driver with a 5.1 ns propagation delay, ideal for industrial applications. It operates at a nominal voltage of 5V and features 3-state output characteristics. With a compact flatpack design, it supports efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,748 parts In-Stock

1+ parts

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3,748

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Vyrian

USA . 1,052 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,052

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Anansix

USA . 444 parts In-Stock

1+ parts

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444

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,855 parts In-Stock

1+ parts

$9.320

100+ parts

-

1k+ parts

$8.947

10k+ parts

$8.947

2,855

$9.320

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$8.947

$8.947

One Stop Electronics

USA . 1,259 parts In-Stock

1+ parts

$34.000

100+ parts

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1,259

$34.000

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UNI Independent Distributors

Spain . 7,847 parts In-Stock

1+ parts

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7,847

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Corphita

USA . 4,432 parts In-Stock

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4,432

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Overview

Elevate your designs with the MB2245BB-T from NXP Semiconductors, a trusted leader in innovative solutions. This versatile bus driver and transceiver offers exceptional performance in demanding applications, ensuring seamless data flow with minimal delay. Designed for reliability and efficiency, it thrives in industrial environments, delivering robustness you can count on. Unlock new possibilities and enhance your systems with this cutting-edge component that prioritizes quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective materials provide reliability and longevity for various applications.

Surface Mount: YES

Surface mount capability enables efficient PCB layout and reduces overall footprint.

No. of Functions: 2

Dual functionality allows for more versatile applications in a single package.

Package Shape: SQUARE

Square package shape allows for easier placement and alignment on the PCB.

No. of Bits: 8

8-bit data handling ensures sufficient data throughput for many digital applications.

Nominal Supply Voltage / Vsup (V): 5

Standard operating voltage of 5V guarantees compatibility with a wide range of logic levels.

Load Capacitance (CL): 50 pF

Low load capacitance ensures faster switching speeds and improved signal integrity.

No. of Terminals: 52

A higher terminal count allows for extensive connectivity options in complex designs.

Package Style (Meter): FLATPACK

Flatpack style supports compact design, making it ideal for space-constrained applications.

Propagation Delay (tpd): 5.1 ns

Low propagation delay offers high-speed performance, suitable for quick data transfer.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Output Characteristics: 3-STATE

3-state output function enhances flexibility in bus systems, allowing for multiple device interconnections.

Minimum Operating Temperature: -40 °C

Ability to operate at extreme low temperatures makes it suitable for industrial and automotive applications.

Terminal Position: QUAD

Quad terminal positioning enhances mechanical stability and ease of soldering.

No. of Ports: 2

Two-port design facilitates multiple channels for data transmission, enhancing connectivity.

Maximum Seated Height: 2.45 mm

Low seated height allows for a low-profile design, beneficial in compact electronic devices.

Width: 10 mm

Compact width helps in efficient utilization of PCB layout space.

Output Polarity: TRUE

True output polarity can simplify design and integration into various digital systems.

Minimum Supply Voltage (Vsup): 4.5 V

Minimum supply voltage of 4.5V ensures compatibility with lower voltage applications.

Length: 10 mm

Short length promotes a compact design, essential in modern electronics.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating indicates reliability and robustness for harsh environments.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide easy PCB mounting and soldering reliability.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for dense packing on the PCB without sacrificing performance.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity ensures reasonable handling precautions are adequate for assembly.

Maximum Supply Voltage (Vsup): 5.5 V

Maximum supply voltage allows for flexibility in designing with varying power supplies.

Maximum Power Supply Current (ICC): 60 mA

Ability to handle up to 60 mA of current supports multiple load conditions in applications.

Technical Specifications

Bus Driver & Transceivers MB2245BB-T attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH DIRECTION CONTROL

Family:

MB

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

60 mA

Propagation Delay (tpd):

5.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

MB2245BB-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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