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MB2241BB-T

NXP Semiconductors

MB2241BB-T by NXP Semiconductors

MB2241BB-T by NXP Semiconductors is a 4-bit bus driver with a 5.1 ns propagation delay, ideal for high-speed data transmission. It operates within a supply voltage range of 4.5-5.5 V and supports industrial applications with a max temp of 85 °C. Its compact flatpack design features 52 terminals for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,558 parts In-Stock

1+ parts

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2,558

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Anansix

USA . 1,590 parts In-Stock

1+ parts

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1k+ parts

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1,590

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Digiode

USA . 193 parts In-Stock

1+ parts

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193

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,138 parts In-Stock

1+ parts

$0.530

100+ parts

-

1k+ parts

$0.368

10k+ parts

$0.368

2,138

$0.530

-

$0.368

$0.368

One Stop Electronics

USA . 782 parts In-Stock

1+ parts

$63.000

100+ parts

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782

$63.000

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UNI Independent Distributors

Spain . 8,223 parts In-Stock

1+ parts

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8,223

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Corphita

USA . 3,584 parts In-Stock

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3,584

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Overview

Unlock superior performance with the MB2241BB-T by NXP Semiconductors, a trusted leader in innovative technology. This versatile bus driver & transceiver excels across diverse applications, ensuring seamless data communication while boasting robust quality and reliability. With its compact design and efficient operation, it enhances system performance, saving space and energy. Choose MB2241BB-T for unmatched value and elevate your project to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material ensures longevity and reliability in various environments.

Surface Mount: YES

Allows for compact designs and high-density PCB layouts, making it suitable for modern electronics.

No. of Functions: 4

Multiple functions enhance versatility, allowing for multifaceted applications in bus driving and interfacing.

Package Shape: SQUARE

Square shape optimizes board space and simplifies placement during manufacturing.

No. of Bits: 4

Supports 4-bit data transmission, which is efficient for a range of digital applications.

Nominal Supply Voltage / Vsup: 5 V

Standard voltage level compatible with most digital circuits, ensuring ease of integration.

Load Capacitance (CL): 50 pF

Low load capacitance facilitates faster switching speeds, improving overall circuit performance.

No. of Terminals: 52

Relatively high terminal count allows for complex connections while providing robust performance.

Package Style (Meter): FLATPACK

Flatpack design supports efficient thermal management and is suitable for high-density applications.

Propagation Delay (tpd): 5.1 ns

Fast propagation delay ensures high-speed signal integrity, crucial for performance-centric applications.

Maximum Operating Temperature: 85 °C

Suitable for a range of environments, ensuring reliability in industrial applications.

Output Characteristics: 3-STATE

3-state output allows for easy bus control, reducing contention and improving data transmission.

Minimum Operating Temperature: -40 °C

Wide temperature range allows operation in extreme conditions, enhancing adaptability.

Terminal Position: QUAD

Quad terminal position optimizes connection space and allows for efficient PCB layout.

No. of Ports: 2

Dual-port functionality enables communication with multiple devices, increasing overall system efficiency.

Maximum Seated Height: 2.45 mm

Low profile allows for compact installations, essential for space-constrained applications.

Width: 10 mm

Standard width facilitates easy integration into various circuit designs.

Output Polarity: TRUE

True output polarity ensures compatibility with common digital logic levels.

Minimum Supply Voltage (Vsup): 4.5 V

Minimum supply voltage ensures flexibility in power supply options without compromising performance.

Length: 10 mm

Standard length contributes to a compact footprint, allowing for effective use in tight spaces.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability in harsh operating conditions.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and reliability in high-volume manufacturing.

Terminal Pitch: 0.65 mm

Small terminal pitch supports high-density designs and allows for efficient use of PCB space.

Maximum Supply Voltage (Vsup): 5.5 V

Flexible supply voltage range supports a variety of applications, increasing the component's usability.

Maximum Power Supply Current (ICC): 60 mA

High current capacity enables robust performance in demanding applications without risk of supply failure.

Technical Specifications

Bus Driver & Transceivers MB2241BB-T attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

OUTPUT ENABLE ACTIVE HIGH FOR TWO FUNCTIONS

Family:

MB

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

60 mA

Propagation Delay (tpd):

5.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

MB2241BB-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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