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LPC5534JBD64K

NXP Semiconductors

LPC5534JBD64K by NXP Semiconductors

NXP Semiconductors' LPC5534JBD64K is a 32-bit microcontroller with Cortex-M33 CPU family, offering 131072 ROM words and 98304 RAM bytes. It features 13-Ch 16-Bit ADC channels, CAN connectivity, and operates at a max clock frequency of 32 MHz. Ideal for applications requiring low power consumption and high-speed processing in various industries.

Median Price

$9.190

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 800 parts In-Stock

1+ parts

$9.190

100+ parts

$6.061

1k+ parts

$5.537

10k+ parts

$5.421

800

$9.190

$6.061

$5.537

$5.421

Flip Electronics (Authorized)

USA . 8,000 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.445

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100

$5.445

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Digiode

USA . 2,762 parts In-Stock

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$6.650

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2,762

$6.650

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Flip Electronics

USA . 16,000 parts In-Stock

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Vyrian

USA . 4,794 parts In-Stock

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Anansix

USA . 315 parts In-Stock

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315

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,262 parts In-Stock

1+ parts

$5.445

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$5.336

6,262

$5.445

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$5.336

Ampacity Inc.

Singapore . 4,092 parts In-Stock

1+ parts

$5.950

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4,092

$5.950

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Corphita

USA . 2,009 parts In-Stock

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$6.300

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UNI Independent Distributors

Spain . 6,416 parts In-Stock

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Microchip USA

USA . 2,547 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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$5.336

1k+ parts

$5.173

10k+ parts

$5.064

2,000

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$5.336

$5.173

$5.064

Argo Parts USA

USA . 1,634 parts In-Stock

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Overview

Discover the LPC5534JBD64K from NXP Semiconductors, a cutting-edge microcontroller that delivers unparalleled performance and reliability. This versatile device boasts advanced features like integrated cache, DAC channels, and boundary scan, making it ideal for a wide range of applications. With its compact design and low power mode, this microcontroller offers exceptional value to customers seeking efficient solutions for their projects. Trust the quality and expertise of NXP Semiconductors to elevate your designs to the next level with the LPC5534JBD64K.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the chip, ensuring a longer lifespan.

Integrated Cache: YES

Enhances performance by storing frequently accessed data for faster retrieval.

Maximum Supply Voltage: 3.6 V

Allows for a higher operating voltage, providing flexibility in power requirements.

CPU Family: CORTEX-M33

Belongs to a well-established and reliable CPU family, ensuring compatibility and support.

ADC Channels: YES

Enables analog-to-digital conversion for sensor inputs or other analog signals.

DMA Channels: YES

Facilitates efficient data transfer without CPU intervention, improving overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing architecture, which enhances speed and efficiency.

Maximum Clock Frequency: 32 MHz

Provides high processing speed for demanding applications or real-time processing.

Technical Specifications

Microcontrollers LPC5534JBD64K attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

68

No. of External Interrupts:

8

No. of I/O Lines:

39

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

98304

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, SERCOMM(8)

Peripherals:

BOD, COMPARATOR(4), POR, RTC, TIMER(10), WDT(2)

Analog To Digital Convertors:

13-Ch 16-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

LPC5534JBD64K Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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