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LPC5512JBD64K

NXP Semiconductors

LPC5512JBD64K by NXP Semiconductors

NXP Semiconductors LPC5512JBD64K is a 32-bit microcontroller with Cortex-M33 CPU, operating at max 32 MHz. Featuring 10-Ch 16-Bit ADCs and PWM channels, it's ideal for applications requiring BOD, CRC, DMA(33), RTC, and more peripherals. With a wide supply voltage range of 1.8V to 3.6V and temp range of -40°C to +105°C, it suits various industrial automation and IoT projects.

Median Price

$3.326

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 800 parts In-Stock

1+ parts

$4.460

100+ parts

$2.810

1k+ parts

$2.534

10k+ parts

$2.422

800

$4.460

$2.810

$2.534

$2.422

Verical

USA . 9,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.192

10k+ parts

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9,600

-

-

$2.192

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,532 parts In-Stock

1+ parts

$3.534

100+ parts

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2,532

$3.534

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Flip Electronics

USA . 32,000 parts In-Stock

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32,000

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Vyrian

USA . 4,161 parts In-Stock

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4,161

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Anansix

USA . 1,520 parts In-Stock

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1,520

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Distributors (Availability)

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Semicontronic

India . 555 parts In-Stock

1+ parts

$2.860

100+ parts

$2.788

1k+ parts

$2.774

10k+ parts

-

555

$2.860

$2.788

$2.774

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Ampacity Inc.

Singapore . 343 parts In-Stock

1+ parts

$2.860

100+ parts

-

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343

$2.860

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Corphita

USA . 2,593 parts In-Stock

1+ parts

$3.348

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2,593

$3.348

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AZTECH Wire

Italy . 748 parts In-Stock

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$17.972

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748

$17.972

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Corohmni

South Africa . 266 parts In-Stock

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$31.421

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266

$31.421

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Aztec Data Supply Inc.

USA . 1,500 parts In-Stock

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$75.440

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1,500

$75.440

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Microchip USA

USA . 6,811 parts In-Stock

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UNI Independent Distributors

Spain . 4,544 parts In-Stock

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4,544

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Argo Parts USA

USA . 3,726 parts In-Stock

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3,726

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Continental Prestige Electronics

USA . 24 parts In-Stock

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24

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Overview

Experience seamless performance and reliability with the LPC5512JBD64K by NXP Semiconductors. As a leading manufacturer of microcontrollers, NXP Semiconductors delivers cutting-edge technology that is perfect for a wide range of applications. This microcontroller offers unmatched value, benefits, and advantages to customers looking for quality solutions. With features like 32-bit processing power, advanced peripherals, and a wide range of connectivity options, the LPC5512JBD64K is the ideal choice for your next project. Trust NXP Semiconductors to provide you with the tools you need to succeed.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards.

Maximum Supply Voltage: 3.6 V

Provides a wide range of operating voltage options.

Package Shape: SQUARE

Offers a compact and space-saving design for integration.

Bit Size: 32

Ensures high performance and efficiency in processing data.

No. of Terminals: 64

Provides ample connectivity options for various external devices.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Enhances durability and reliability in a compact form factor.

Minimum Supply Voltage: 1.8 V

Allows for lower power consumption and efficient operation.

Maximum Operating Temperature: 105 °C

Ensures reliable performance even in high-temperature environments.

CPU Family: CORTEX-M33

Represents a superior processing architecture for optimized performance.

Minimum Operating Temperature: -40 °C

Offers functionality in extreme temperature conditions.

Terminal Finish: TIN

Provides excellent conductivity and corrosion resistance.

ADC Channels: YES

Enables accurate analog-to-digital conversions for sensor inputs.

DMA Channels: YES

Facilitates efficient data transfer between peripherals without CPU intervention.

Terminal Position: QUAD

Enhances connectivity options and ease of circuit design.

ROM Words: 65536

Offers ample storage capacity for program and data memory.

Width: 10 mm

Provides a compact and space-efficient footprint for integration.

Peripherals: BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Includes a wide range of peripherals for versatile applications.

Maximum Clock Frequency: 32 MHz

Ensures high-speed processing capabilities for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient reflow soldering during manufacturing.

Peak Reflow Temperature °C: 260

Ensures proper soldering and reliability in assembly processes.

Length: 10 mm

Offers a balanced form factor for compact designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Represents a powerful and efficient microcontroller architecture.

RAM Bytes: 49152

Provides ample memory space for data storage and manipulation.

Terminal Form: GULL WING

Offers a reliable and secure terminal connection design.

Analog To Digital Convertors: 10-Ch 16-Bit

Allows for precise conversion of analog signals to digital data.

Nominal Supply Voltage: 3 V

Suitable for a wide range of applications with standard voltage requirements.

PWM Channels: YES

Enables precise control of pulse-width modulation for various applications.

Connectivity: I2C, I2S, CAN, SPI, UART, USART, USB

Supports a wide range of communication interfaces for versatile connectivity.

ROM Programmability: FLASH

Provides flexibility for reprogramming and updating firmware.

Terminal Pitch: 0.5 mm

Offers compatibility with standard PCB layouts and designs.

Moisture Sensitivity Level (MSL): 3

Ensures reliability and performance in various environmental conditions.

Speed: 150 rpm

Represents a high-speed processing capability for efficient operations.

On Chip Program ROM Width: 8

Offers efficient program storage on the chip for quick access.

No. of I/O Lines: 36

Provides ample input and output options for external interfacing.

Technical Specifications

Microcontrollers LPC5512JBD64K attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

49152

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, CAN, SPI, UART, USART, USB

Peripherals:

BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 16-Bit

Trade Compliance

LPC5512JBD64K Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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