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LPC54S016JET180E

NXP Semiconductors

LPC54S016JET180E by NXP Semiconductors

NXP Semiconductors' LPC54S016JET180E is a 32-bit microcontroller with Cortex-M4 CPU, offering 368640 bytes of RAM and 16K data EEPROM. It features 12 ADC channels, 30 DMA channels, and peripherals like BOD, RTC, and WDT. Ideal for applications requiring CAN, Ethernet, I2C, SPI connectivity at a max clock frequency of 25 MHz.

Median Price

$12.270

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7 parts In-Stock

1+ parts

$12.270

100+ parts

$8.964

1k+ parts

$7.647

10k+ parts

$7.481

7

$12.270

$8.964

$7.647

$7.481

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,815 parts In-Stock

1+ parts

$10.080

100+ parts

-

1k+ parts

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1,815

$10.080

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Vyrian

USA . 5,889 parts In-Stock

1+ parts

-

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1k+ parts

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5,889

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Anansix

USA . 236 parts In-Stock

1+ parts

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236

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,718 parts In-Stock

1+ parts

$9.549

100+ parts

-

1k+ parts

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10k+ parts

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4,718

$9.549

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Vigor

Singapore . 189 parts In-Stock

1+ parts

$10.770

100+ parts

-

1k+ parts

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189

$10.770

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Component Stockers USA

USA . 196 parts In-Stock

1+ parts

$12.750

100+ parts

$10.020

1k+ parts

-

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196

$12.750

$10.020

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Microchip USA

USA . 2,387 parts In-Stock

1+ parts

$38.300

100+ parts

$37.760

1k+ parts

$37.480

10k+ parts

$37.210

2,387

$38.300

$37.760

$37.480

$37.210

UNI Independent Distributors

Spain . 5,758 parts In-Stock

1+ parts

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5,758

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Perfect Parts

USA . 423 parts In-Stock

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423

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Overview

Experience the next level of innovation with the LPC54S016JET180E by NXP Semiconductors. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. From IoT devices to industrial automation, this product stands out with its advanced features and seamless connectivity options. Elevate your projects with the LPC54S016JET180E and unlock endless possibilities in the world of technology. Choose quality, choose NXP Semiconductors.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy mounting on PCBs, saving space and making the product more compact.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape is easier to handle and mount compared to irregular shapes.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex computations efficiently.

No. of Terminals: 180

The high number of terminals allows for versatile connectivity options.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers high density mounting, making the product suitable for applications where space is a constraint.

Minimum Supply Voltage: 1.71 V

Can operate at low voltage levels, suitable for battery-powered applications.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial and automotive applications.

CPU Family: CORTEX-M4

CORTEX-M4 architecture offers high performance and energy efficiency for embedded systems.

Minimum Operating Temperature: -40 °C

Capable of functioning in harsh environmental conditions with low temperatures.

ADC Channels: YES

Analog to Digital Converters allow for interfacing with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer between peripherals and memory without CPU intervention.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides fast processing capabilities for real-time applications.

RAM Bytes: 368640

Ample amount of RAM for data storage and manipulation.

Analog To Digital Convertors: 12-Ch 12-Bit

Provides high-resolution conversion for accurate analog data processing.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for reliable operation of the microcontroller.

Connectivity: CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2)

Wide range of connectivity options for interfacing with other devices and networks.

ROM Programmability: FLASH

Flash memory allows for in-system programming and updating of firmware.

Moisture Sensitivity Level (MSL): 3

Suitable for applications with moderate exposure to moisture.

No. of I/O Lines: 145

Sufficient number of input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LPC54S016JET180E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

145

No. of Terminals:

180

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

368640

ROM Programmability:

FLASH

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2)

Peripherals:

BOD, DMA(30),POR, RTC, TIMER(9), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC54S016JET180E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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