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LPC54616J512ET100E

NXP Semiconductors

LPC54616J512ET100E by NXP Semiconductors

NXP Semiconductors' LPC54616J512ET100E microcontroller features a 32-bit CORTEX-M4 CPU, 14-bit address bus, and 16-bit external data bus. With 12 ADC channels and PWM support, it's ideal for applications requiring CAN, Ethernet, I2C, I2S, SPI, USART, USB connectivity at up to 25 MHz clock frequency.

Median Price

$7.196

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 445 parts In-Stock

1+ parts

$3.543

100+ parts

$3.331

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-

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445

$3.543

$3.331

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Chip1Stop

Japan . 260 parts In-Stock

1+ parts

$6.230

100+ parts

$5.710

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-

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260

$6.230

$5.710

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Mouser Electronics

USA . 34 parts In-Stock

1+ parts

$11.010

100+ parts

$7.640

1k+ parts

$7.130

10k+ parts

$7.040

34

$11.010

$7.640

$7.130

$7.040

DigiKey

USA . 52 parts In-Stock

1+ parts

$12.920

100+ parts

$8.695

1k+ parts

$8.103

10k+ parts

$7.925

52

$12.920

$8.695

$8.103

$7.925

Verical

USA . 9,880 parts In-Stock

1+ parts

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$7.196

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9,880

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$7.196

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Flip Electronics (Authorized)

USA . 1,024 parts In-Stock

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1,024

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Distributors (In-Stock)

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Digiode

USA . 4,980 parts In-Stock

1+ parts

$8.636

100+ parts

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4,980

$8.636

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$9.380

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450

$9.380

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Vyrian

USA . 8,907 parts In-Stock

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8,907

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Anansix

USA . 1,200 parts In-Stock

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Flip Electronics

USA . 1,024 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 318 parts In-Stock

1+ parts

$5.620

100+ parts

$5.480

1k+ parts

$5.451

10k+ parts

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318

$5.620

$5.480

$5.451

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Ampacity Inc.

Singapore . 50 parts In-Stock

1+ parts

$5.770

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50

$5.770

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Corphita

USA . 1,052 parts In-Stock

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$8.181

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1,052

$8.181

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$9.380

100+ parts

$8.911

1k+ parts

-

10k+ parts

$8.348

450

$9.380

$8.911

-

$8.348

Continental Prestige Electronics

USA . 6,435 parts In-Stock

1+ parts

$9.380

100+ parts

-

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10k+ parts

$9.192

6,435

$9.380

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$9.192

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$10.881

100+ parts

$10.010

1k+ parts

$9.380

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200

$10.881

$10.010

$9.380

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Corohmni

South Africa . 503 parts In-Stock

1+ parts

$23.632

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503

$23.632

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Microchip USA

USA . 1,495 parts In-Stock

1+ parts

$35.760

100+ parts

$35.250

1k+ parts

$34.990

10k+ parts

$34.730

1,495

$35.760

$35.250

$34.990

$34.730

Aztec Data Supply Inc.

USA . 882 parts In-Stock

1+ parts

$59.470

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882

$59.470

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UNI Independent Distributors

Spain . 4,346 parts In-Stock

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Argo Parts USA

USA . 3,059 parts In-Stock

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Robosynatics

Brazil . 968 parts In-Stock

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968

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Lucentia Tech

USA . 968 parts In-Stock

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$83.862

1k+ parts

$82.150

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$82.150

968

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$83.862

$82.150

$82.150

Glotronic Ltd.

UK . 120 parts In-Stock

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120

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Overview

Unlock the power of cutting-edge technology with the LPC54616J512ET100E microcontroller by NXP Semiconductors. Designed with precision and expertise, this innovative device offers unparalleled performance and reliability for a wide range of applications. From IoT devices to industrial automation, this microcontroller provides seamless connectivity and advanced features to bring your projects to life. Experience the quality and value that NXP Semiconductors delivers with the LPC54616J512ET100E, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller a convenient choice for mass production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power input, providing flexibility in design.

Address Bus Width: 14

Having a 14-bit address bus width allows for access to a large memory address space, which is essential for handling complex calculations and data storage.

Package Shape: SQUARE

The square package shape offers good symmetry and uniformity, making it easier to layout and integrate the microcontroller into a design.

Bit Size: 32

A 32-bit architecture provides higher computational power and precision, making this microcontroller suitable for demanding applications that require fast processing.

No. of Terminals: 100

With a large number of terminals, this microcontroller can interface with multiple peripherals and components, expanding its functionality and versatility.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch allows for high-density mounting, saving space on the PCB and enabling compact designs.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources, enhancing the microcontroller's usability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, ensuring reliable operation in various applications.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family offers high performance and efficiency, enabling fast and reliable execution of tasks, making this microcontroller suitable for real-time applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this microcontroller to function in extreme cold environments, making it suitable for a wide range of applications.

ADC Channels: YES

Having ADC channels enables analog input conversion, allowing the microcontroller to process and interact with analog signals, expanding its applications in sensor interfacing and data acquisition.

DMA Channels: YES

With DMA channels, data can be transferred between peripherals and memory without CPU intervention, improving system performance and efficiency.

Terminal Position: BOTTOM

Having terminals at the bottom facilitates easy PCB layout and routing, simplifying the integration of the microcontroller into the design.

ROM Words: 524288

The large ROM size allows for storing a significant amount of program data and instructions, enabling the microcontroller to run complex algorithms and applications.

Width: 9 mm

The compact width of 9mm makes this microcontroller suitable for space-constrained designs and applications where size matters.

External Data Bus Width: 16

A wide external data bus width of 16 bits enables faster data transfer between the microcontroller and external memory or peripherals, enhancing overall system performance.

Peripherals: BOD, DMA(30), RTC, TIMER(8), WDT

The inclusion of various peripherals such as BOD, DMA, RTC, Timer, and WDT enhances the functionality and capabilities of this microcontroller, making it versatile for a wide range of applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz allows for fast processing and execution of instructions, making this microcontroller suitable for applications that require quick response times.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this microcontroller can endure the soldering process during manufacturing without damage, ensuring reliable assembly.

Length: 9 mm

The compact length of 9mm complements the width, making this microcontroller a suitable choice for compact and space-efficient designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient instruction execution and performance, making it suitable for a wide range of applications that require fast processing.

RAM Bytes: 163840

Having a large amount of RAM allows for efficient data storage and manipulation, enabling the microcontroller to handle complex tasks and multitasking operations effectively.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and connection to the PCB, ensuring reliable electrical contact and robust mechanical stability.

Analog To Digital Convertors: 12-Ch 12-Bit

With 12 analog to digital converters at 12-bit resolution, this microcontroller can accurately convert analog signals to digital data, making it ideal for sensor interfacing and measurement applications.

Nominal Supply Voltage: 1.8 V

Having a stable nominal supply voltage of 1.8V ensures reliable and efficient operation of the microcontroller, enhancing its performance and durability.

PWM Channels: YES

The availability of PWM channels enables the generation of accurate pulse-width modulation signals, essential for motor control, power management, and other applications requiring precise control.

Connectivity: CAN, ETHERNET, I2C(9), I2S(9), SPI(9), USART(9), USB(2)

The microcontroller's connectivity options including CAN, Ethernet, I2C, I2S, SPI, USART, and USB provide versatile communication interfaces, making it suitable for networking and data exchange applications.

ROM Programmability: FLASH

Being programmable via Flash memory enables easy and efficient updating of firmware and software, allowing for flexibility and adaptability in applications and systems.

Terminal Pitch: 0.8 mm

With a fine terminal pitch of 0.8mm, this microcontroller supports high-density mounting, enabling compact designs and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

Having MSL level 3 indicates that this microcontroller is capable of withstanding moderate levels of moisture exposure, ensuring reliability in various environmental conditions.

Speed: 180 rpm

The speed of 180 rpm ensures rapid data processing and execution, making this microcontroller suitable for applications that require high-speed performance and responsiveness.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM allows for efficient storage and execution of program instructions, contributing to the microcontroller's performance and reliability.

No. of I/O Lines: 64

With 64 I/O lines, this microcontroller offers ample input/output capabilities for interfacing with various external devices and peripherals, enhancing its connectivity and functionality.

Technical Specifications

Microcontrollers LPC54616J512ET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

14

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

163840

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, ETHERNET, I2C(9), I2S(9), SPI(9), USART(9), USB(2)

Peripherals:

BOD, DMA(30), RTC, TIMER(8), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC54616J512ET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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