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LPC2388FBD144,551

NXP Semiconductors

LPC2388FBD144,551 by NXP Semiconductors

NXP Semiconductors' LPC2388FBD144,551 is a 32-bit ARM7 microcontroller with 3.3V power supply, 24 MHz clock frequency, and 100352 bytes of RAM. Ideal for industrial applications, it features DAC and ADC channels, PWM support, and DMA capabilities for efficient data processing in compact designs.

Median Price

$24.817

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

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$15.014

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$15.014

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Component Electronics Inc.

Canada . 1 parts In-Stock

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$34.620

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$25.960

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$22.500

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1

$34.620

$25.960

$22.500

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Vyrian

USA . 10,058 parts In-Stock

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Digiode

USA . 4,884 parts In-Stock

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Anansix

USA . 1,266 parts In-Stock

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Flip Electronics

USA . 360 parts In-Stock

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J2 Sourcing AB

Sweden . 260 parts In-Stock

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Connector Distribution Corp

USA . 1 parts In-Stock

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Right Parts Inc.

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Distributors (Availability)

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One Stop Electronics

USA . 202 parts In-Stock

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$2.000

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$2.000

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Semicontronic

India . 7,061 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

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$4.850

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7,061

$5.000

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$4.850

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AZTECH Wire

Italy . 363 parts In-Stock

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$14.080

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Continental Prestige Electronics

USA . 5,949 parts In-Stock

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$14.713

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Netroflash

USA . 2,000 parts In-Stock

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$15.014

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$14.263

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$13.963

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$15.014

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$13.963

Aztec Data Supply Inc.

USA . 1,817 parts In-Stock

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$26.130

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$26.130

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Ampacity Inc.

Singapore . 1,029 parts In-Stock

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$34.000

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Microchip USA

USA . 1,136 parts In-Stock

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Lucentia Tech

USA . 23,125 parts In-Stock

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$20.663

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$20.242

$20.242

Lixinc

USA . 13,601 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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Argo Parts USA

USA . 4,840 parts In-Stock

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Corphita

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A-Z Elektronik GmbH

Germany . 2,834 parts In-Stock

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UNI Independent Distributors

Spain . 1,787 parts In-Stock

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Futuretech Components

Singapore . 1,500 parts In-Stock

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Corohmni

South Africa . 1,241 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Overview

Unlock the potential of your next project with the LPC2388FBD144,551 microcontroller from NXP Semiconductors. With a powerful ARM7 CPU family, this versatile device offers a range of applications in various industries. From DAC channels to PWM channels, this microcontroller provides exceptional performance and functionality. Its industrial-grade temperature tolerance and low profile package make it perfect for demanding environments. Trust NXP Semiconductors for high-quality products that deliver value and innovation to customers worldwide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Allows for lightweight and durable packaging, making the microcontroller suitable for various applications.

Surface Mount: YES

Facilitates easy and efficient integration onto circuit boards.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring proper functionality.

Package Shape: SQUARE

Helps in efficient space utilization on the PCB.

Bit Size: 32

Offers a balance between processing power and efficiency for a wide range of applications.

DAC Channels: YES

Enables the microcontroller to interface with analog devices and sensors.

No. of Terminals: 144

Provides ample connectivity options for interfacing with external components.

Minimum Supply Voltage: 3 V

Allows for operation in scenarios where the supply voltage might drop below the nominal level.

CPU Family: ARM7

Offers a powerful and efficient processing core for executing complex tasks.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments.

Technical Specifications

Microcontrollers LPC2388FBD144,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

104

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

100352

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

LPC2388FBD144,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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