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LPC2294HBD144/01K

NXP Semiconductors

LPC2294HBD144/01K by NXP Semiconductors

NXP Semiconductors' LPC2294HBD144/01K is a 32-bit ARM7 microcontroller with 24-bit address bus width and 8-bit on-chip data RAM. It features 112 I/O lines, 8-channel ADC, and peripherals like PWM(6), RTC, TIMER(16), WDT for applications in low power mode operation at up to 25 MHz clock frequency.

Median Price

$25.847

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 50 parts In-Stock

1+ parts

$24.120

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50

$24.120

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Chip1Stop

Japan . 257 parts In-Stock

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$24.500

100+ parts

$16.600

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-

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257

$24.500

$16.600

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Adafruit Industries

USA . 500 parts In-Stock

1+ parts

$25.847

100+ parts

$25.847

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$25.847

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-

500

$25.847

$25.847

$25.847

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Arrow

USA . 274 parts In-Stock

1+ parts

$29.570

100+ parts

$19.080

1k+ parts

$18.420

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274

$29.570

$19.080

$18.420

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Verical

USA . 274 parts In-Stock

1+ parts

$29.570

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$19.080

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$18.420

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274

$29.570

$19.080

$18.420

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Element14

Singapore . 250 parts In-Stock

1+ parts

$46.460

100+ parts

$31.820

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250

$46.460

$31.820

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Future Electronics

Canada . 300 parts In-Stock

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$20.330

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300

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$20.330

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Distributors (In-Stock)

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Digiode

USA . 4,085 parts In-Stock

1+ parts

$22.914

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4,085

$22.914

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Nova Conductors

Japan . 28 parts In-Stock

1+ parts

$25.340

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28

$25.340

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Chip Stock

USA . 10,370 parts In-Stock

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10,370

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Vyrian

USA . 4,768 parts In-Stock

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4,768

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Schukat

Germany . 685 parts In-Stock

1+ parts

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$24.390

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$24.390

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Anansix

USA . 138 parts In-Stock

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Component Sense

UK . 56 parts In-Stock

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TME

Poland . 40 parts In-Stock

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$24.240

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40

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$24.240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 176 parts In-Stock

1+ parts

$17.280

100+ parts

$16.848

1k+ parts

$16.762

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176

$17.280

$16.848

$16.762

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Ampacity Inc.

Singapore . 36 parts In-Stock

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$17.280

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$17.280

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Corphita

USA . 1,162 parts In-Stock

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$21.708

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$21.708

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AZTECH Wire

Italy . 1,109 parts In-Stock

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$22.060

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$22.060

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$25.847

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$25.847

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$25.847

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500

$25.847

$25.847

$25.847

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Continental Prestige Electronics

USA . 7 parts In-Stock

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$27.340

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Vigor

Singapore . 2,672 parts In-Stock

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$28.652

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$28.652

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Aztec Data Supply Inc.

USA . 206 parts In-Stock

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$35.920

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Corohmni

South Africa . 388 parts In-Stock

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$75.370

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$75.370

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Microchip USA

USA . 2,094 parts In-Stock

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$77.717

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Argo Parts USA

USA . 4,374 parts In-Stock

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UNI Independent Distributors

Spain . 3,368 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Elevate your next project with the LPC2294HBD144/01K microcontroller by NXP Semiconductors. Designed for versatility and reliability, this cutting-edge product offers a wide range of applications in various industries. With NXP Semiconductors' reputation for quality and innovation, you can trust that you're getting a top-of-the-line product that delivers exceptional performance. Experience the value and benefits of the LPC2294HBD144/01K, providing customers with advanced features and capabilities to bring their projects to the next level. Choose NXP Semiconductors for unparalleled excellence in microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for portable and rugged applications.

Surface Mount: YES

Ease of installation and reduced PCB space requirement make it a convenient choice for compact electronic devices.

Maximum Supply Voltage: 1.95 V

Low power consumption and compatibility with various power sources make it versatile for different applications.

On Chip Data RAM Width: 8

Efficient data processing and storage capability for running complex programs.

Address Bus Width: 24

Allows for access to a larger memory space, enabling the handling of extensive data and program storage.

Package Shape: SQUARE

Easier PCB layout and space utilization for compact designs.

Bit Size: 32

High computational power and ability to handle complex algorithms efficiently.

No. of Terminals: 144

Sufficient I/O options for connecting to various peripherals and external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhanced thermal performance, reduced overall size, and compatibility with modern manufacturing processes.

Minimum Supply Voltage: 1.65 V

Allows operation in low power scenarios while maintaining performance.

Maximum Operating Temperature: 125 °C

Suitable for industrial and automotive applications where high temperatures may be encountered.

CPU Family: ARM7

Known for its power efficiency and high performance, ideal for energy-conscious applications.

No. of External Interrupts: 4

Enables responsive interrupt handling for real-time applications and input/output operations.

Minimum Operating Temperature: -40 °C

Can operate reliably in harsh environments with low temperatures.

ADC Channels: YES

Allows for analog signal conversion, essential for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

Enables easy soldering and secure connection during PCB assembly.

ROM Words: 262144

Ample program memory for storing code and data, supporting complex software requirements.

Maximum Seated Height: 1.6 mm

Low profile design for slim devices and space-constrained applications.

Width: 20 mm

Compact form factor for integration into small electronic devices.

Boundary Scan: YES

Facilitates debugging, testing, and programming during the PCB manufacturing phase and operational life.

External Data Bus Width: 32

Efficient data transfer and communication with external memory and peripherals.

Peripherals: PWM(6), RTC, TIMER(16), WDT

Versatile set of built-in peripherals for timing, communications, and control applications.

Maximum Clock Frequency: 25 MHz

High speed processing capabilities for quick execution of instructions and tasks.

Peak Reflow Temperature °C: 260

Designed to withstand high-temperature soldering processes for reliable assembly.

Length: 20 mm

Compact dimensions for space-efficient PCB layout and embedded system designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient execution of instructions, making it suitable for performance-critical applications.

No. of Timers: 2

Dedicated timing peripherals for managing various time-sensitive tasks and events.

RAM Bytes: 16384

Adequate random-access memory for storing and accessing data during program execution.

Technology: CMOS

Low power consumption and high noise immunity characteristics for efficient operation.

Terminal Form: GULL WING

Secure solder joint formation and easy PCB assembly with this terminal configuration.

Analog To Digital Converters: 8-Ch 10-Bit

Multiple channels for converting analog signals to digital data with good resolution.

Maximum Supply Current: 100 mA

Suitable for low-power applications with moderate current requirements.

Nominal Supply Voltage: 1.8 V

Standard voltage level for compatibility with various power sources and electronic components.

No. of Serial I/Os: 6

Sufficient serial communication ports for interfacing with external devices and peripherals.

PWM Channels: YES

Pulse-width modulation support for precise control of analog signals and motor speed regulation.

Connectivity: CAN(4), I2C, SPI(2), SSP, UART(2)

Multiple communication interfaces for connecting to a wide range of devices and networks.

ROM Programmability: FLASH

Allows for easy and fast reprogramming of the memory contents for quick design iterations and updates.

Terminal Pitch: 0.5 mm

Fine pitch spacing for compact layout and reliable solder connections.

Format: FIXED POINT

Efficient arithmetic operations and handling of numerical data in fixed-point representation.

Moisture Sensitivity Level (MSL): 2

Designed to withstand moderate moisture exposure during storage and operation.

Speed: 60 rpm

Suitable for applications requiring precise control and feedback at a moderate speed.

Low Power Mode: YES

Enables power-saving operation modes for extended battery life and energy efficiency.

On Chip Program ROM Width: 8

Efficient program storage and execution capabilities with wide ROM data bus.

No. of I/O Lines: 112

Versatile input/output options for connecting to external devices and sensors with ease.

Technical Specifications

Microcontrollers LPC2294HBD144/01K attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of External Interrupts:

4

No. of I/O Lines:

112

No. of Serial I/Os:

6

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), I2C, SPI(2), SSP, UART(2)

Peripherals:

PWM(6), RTC, TIMER(16), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC2294HBD144/01K Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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