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LPC2214FBD144/01,5

NXP Semiconductors

LPC2214FBD144/01,5 by NXP Semiconductors

NXP Semiconductors' LPC2214FBD144/01,5 is a 32-bit ARM7 microcontroller with 24-bit address bus width and 32-bit external data bus width. Operating at up to 50 MHz, it features 112 I/O lines and PWM channels for industrial applications requiring high-speed processing and control capabilities.

Median Price

$20.020

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 2,021 parts In-Stock

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Rochester

USA . 46 parts In-Stock

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$18.680

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$16.710

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$15.730

46

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$16.710

$15.730

DigiKey

USA . 46 parts In-Stock

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$21.360

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46

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$21.360

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Distributors (In-Stock)

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Nova Conductors

Japan . 18 parts In-Stock

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$15.350

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Digiode

USA . 1,428 parts In-Stock

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$15.580

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Vyrian

USA . 10,643 parts In-Stock

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Anansix

USA . 2,715 parts In-Stock

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USA . 581 parts In-Stock

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DigiKey Marketplace

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LIBRA Elektronik GmbH

Germany . 10 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,151 parts In-Stock

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$13.940

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Corphita

USA . 2,648 parts In-Stock

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$14.760

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Continental Prestige Electronics

USA . 2,362 parts In-Stock

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$15.350

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$15.043

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Component Stockers USA

USA . 31 parts In-Stock

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$18.510

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Microchip USA

USA . 2,540 parts In-Stock

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Modulus Dynamics

Lithuania . 3,934 parts In-Stock

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$31.535

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$31.535

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$31.535

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3,934

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Corohmni

South Africa . 653 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,311 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Lixinc

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UNI Independent Distributors

Spain . 5,044 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Overview

Unleash the power of innovation with the LPC2214FBD144/01,5 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-notch quality microcontrollers that cater to a wide range of applications. With its advanced features and reliable performance, this product offers unparalleled value to customers seeking cutting-edge solutions. Whether you're working on IoT devices, consumer electronics, or industrial automation, the LPC2214FBD144/01,5 is the perfect choice to bring your projects to life. Experience the benefits of superior technology and unlock endless possibilities with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and resistant to damage, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the overall design.

Maximum Supply Voltage: 1.95 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation.

Address Bus Width: 24

Wide address bus width allows for efficient memory addressing, enhancing overall performance of the microcontroller.

Package Shape: SQUARE

Square package shape facilitates easy mounting and positioning within electronic systems.

Bit Size: 32

32-bit architecture enables the microcontroller to process data and instructions at a faster rate, improving overall performance.

Power Supplies (V): 1.8,3.3

Multiple power supply options provide flexibility in designing power-efficient systems and interfacing with different components.

No. of Terminals: 144

Ample number of terminals allow for easy interfacing with external devices and peripherals, expanding the capabilities of the microcontroller.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage ensures stable operation even in low power scenarios.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Technical Specifications

Microcontrollers LPC2214FBD144/01,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V SUPPLY

Address Bus Width:

24

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

112

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

LPC2214FBD144/01,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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