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LPC2131FBD64/01,15

NXP Semiconductors

LPC2131FBD64/01,15 by NXP Semiconductors

NXP Semiconductors' LPC2131FBD64/01,15 microcontroller features 32-bit architecture with ARM7 CPU family, 8-bit address bus width, and 3.3V power supply. Ideal for industrial applications requiring a max clock frequency of 25MHz, it offers 8192 bytes of RAM and flash ROM programmability for efficient data processing and storage.

Median Price

$12.550

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 58 parts In-Stock

1+ parts

$12.500

100+ parts

$7.960

1k+ parts

$7.500

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58

$12.500

$7.960

$7.500

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Arrow

USA . 512 parts In-Stock

1+ parts

$12.550

100+ parts

$8.060

1k+ parts

$7.619

10k+ parts

-

512

$12.550

$8.060

$7.619

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Verical

USA . 512 parts In-Stock

1+ parts

$12.550

100+ parts

$8.060

1k+ parts

$7.619

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-

512

$12.550

$8.060

$7.619

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DigiKey

USA . 805 parts In-Stock

1+ parts

$13.880

100+ parts

$10.194

1k+ parts

$8.692

10k+ parts

$8.545

805

$13.880

$10.194

$8.692

$8.545

Mouser Electronics

USA . 924 parts In-Stock

1+ parts

$15.390

100+ parts

$9.900

1k+ parts

$9.220

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924

$15.390

$9.900

$9.220

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Flip Electronics (Authorized)

USA . 160 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,251 parts In-Stock

1+ parts

$6.204

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$6.204

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Vyrian

USA . 3,363 parts In-Stock

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Anansix

USA . 696 parts In-Stock

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IBS Electronics

USA . 320 parts In-Stock

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$9.072

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320

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$9.072

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NAC Semi

USA . 320 parts In-Stock

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$9.970

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320

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$9.970

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Flip Electronics

USA . 160 parts In-Stock

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160

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Nova Conductors

Japan . 76 parts In-Stock

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76

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Schukat

Germany . 75 parts In-Stock

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$3.700

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75

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$3.700

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Inventory MP

USA . 16 parts In-Stock

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Florida Circuit

USA . 16 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,619 parts In-Stock

1+ parts

$5.877

100+ parts

-

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2,619

$5.877

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Semicontronic

India . 1,175 parts In-Stock

1+ parts

$6.840

100+ parts

$6.669

1k+ parts

$6.635

10k+ parts

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1,175

$6.840

$6.669

$6.635

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Ampacity Inc.

Singapore . 1,150 parts In-Stock

1+ parts

$6.840

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$6.840

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Corohmni

South Africa . 351 parts In-Stock

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$10.900

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351

$10.900

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Vigor

Singapore . 2,832 parts In-Stock

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$12.330

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$12.330

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Microchip USA

USA . 4,270 parts In-Stock

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$14.701

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$14.701

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Aztec Data Supply Inc.

USA . 526 parts In-Stock

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$34.190

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Lixinc

USA . 12,206 parts In-Stock

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UNI Independent Distributors

Spain . 6,078 parts In-Stock

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Continental Prestige Electronics

USA . 5,418 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,749 parts In-Stock

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Perfect Parts

USA . 1,254 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 3 parts In-Stock

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Overview

Unleash the power of innovation with the LPC2131FBD64/01,15 by NXP Semiconductors. This cutting-edge microcontroller offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this product provides customers with unmatched value, benefits, and advantages. Stay ahead of the curve and elevate your projects with the LPC2131FBD64/01,15.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the microcontroller.

Surface Mount

YES - Allows for easy installation and integration onto circuit boards.

Maximum Supply Voltage

3.6 V - Operates within a safe voltage range to prevent damage.

Address Bus Width

8 - Provides sufficient address space for data processing.

Package Shape

SQUARE - Offers a compact design for space-saving solutions.

Bit Size

32 - Supports high-performance computing and data processing.

Power Supplies (V)

3.3 - Ensures stable power delivery for reliable operation.

No. of Terminals

64 - Allows for multiple connections to other components.

Package Style (Meter)

FLATPACK, LOW PROFILE, FINE PITCH - Ideal for applications requiring a slim and efficient design.

Minimum Supply Voltage

3 V - Can operate at lower voltages for energy efficiency.

Maximum Operating Temperature

85 °C - Can withstand high temperatures for various applications.

CPU Family

ARM7 - Utilizes advanced technology for enhanced performance.

Minimum Operating Temperature

40 °C - Can operate in harsh environments with low temperatures.

Terminal Finish

TIN - Provides a reliable connection for stability and longevity.

ADC Channels

YES - Allows for analog input conversion for versatile functionality.

Terminal Position

QUAD - Ensures convenient placement and connectivity on a circuit board.

ROM Words

32768 - Offers ample storage capacity for program data.

Maximum Seated Height

1.6 mm - Ideal for slim devices with limited space.

Width

10 mm - Compact size for versatility in various applications.

External Data Bus Width

8 - Efficient data transfer for smooth operation.

Maximum Clock Frequency

25 MHz - Supports high-speed processing for quick response times.

Peak Reflow Temperature °C

260 - Withstands high temperatures during manufacturing processes.

Length

10 mm - Compact form factor for space-constrained applications.

Temperature Grade

INDUSTRIAL - Suitable for industrial environments with varying temperatures.

Peripheral IC Type

MICROCONTROLLER, RISC - Provides integrated peripherals and efficient RISC architecture.

RAM Bytes

8192 - Sufficient memory for data storage and processing.

Technology

CMOS - Utilizes advanced CMOS technology for efficient power consumption.

Terminal Form

GULL WING - Ensures secure and reliable connections for stable operation.

Nominal Supply Voltage

3.3 V - Provides consistent power supply for reliable performance.

PWM Channels

YES - Supports pulse-width modulation for accurate control over connected devices.

ROM Programmability

FLASH - Allows for reprogrammable memory for flexibility in applications.

Terminal Pitch

0.5 mm - Close terminal pitch for compact designs and efficient connections.

Speed

60 rpm - Offers quick processing speeds for responsive performance.

No. of I/O Lines

47 - Provides multiple input/output options for versatile connectivity.

Technical Specifications

Microcontrollers LPC2131FBD64/01,15 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

47

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LPC2131FBD64/01,15 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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