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IP3253CZ8-4-TTL

NXP Semiconductors

IP3253CZ8-4-TTL by NXP Semiconductors

IP3253CZ8-4-TTL by NXP Semiconductors is a compact consumer IC designed for industrial applications, featuring an operating temp range of -40 °C to 85 °C. It has 8 terminals in a very thin profile package with no lead design. Ideal for space-constrained environments, it ensures reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 40,000 parts In-Stock

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Vyrian

USA . 3,337 parts In-Stock

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Anansix

USA . 1,594 parts In-Stock

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Digiode

USA . 257 parts In-Stock

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257

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AZTECH Wire

Italy . 11,352 parts In-Stock

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$6.110

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$6.110

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One Stop Electronics

USA . 1,289 parts In-Stock

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$14.800

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Kepictronics

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UNI Independent Distributors

Spain . 8,194 parts In-Stock

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Corphita

USA . 4,919 parts In-Stock

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Perfect Parts

USA . 2,994 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,640 parts In-Stock

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2,640

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Alle Elektronik GmbH

Germany . 1,760 parts In-Stock

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Supply Digital

USA . 1,190 parts In-Stock

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Overview

Elevate your designs with the IP3253CZ8-4-TTL from NXP Semiconductors, a trusted leader in innovative technology. This compact, high-quality consumer IC ensures reliable performance across various applications, from industrial automation to smart home devices. With superior thermal management and robust environmental tolerance, it enhances product longevity while simplifying integration. Choose NXP for cutting-edge solutions that deliver value, efficiency, and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this IC suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for compact designs and efficient use of space on PCBs, facilitating modern electronic designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the circuit board while maintaining balance in layout, aiding in effective signal management.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, it assures compatibility with a wide range of devices, enhancing its versatility.

No. of Terminals: 8

Having 8 terminals provides a good balance of connectivity options, allowing for more complex functionalities in a compact form factor.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile make this IC ideal for space-constrained designs, especially in portable consumer electronics.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can function reliably in a variety of environments, including slightly harsh conditions.

Minimum Operating Temperature: -40 °C

The ability to operate as low as -40 °C makes it suitable for industrial applications alongside consumer electronics, expanding its usability.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The premium terminal finish ensures excellent conductivity and enhanced durability, promoting longevity and performance in applications.

Terminal Position: DUAL

Dual terminal positioning can facilitate better layout options on the PCB, improving routing flexibility during design.

Maximum Seated Height: 0.55 mm

A maximum seated height of 0.55 mm allows for low-profile designs, making it suitable for compact electronic devices.

Width: 1.35 mm

A narrow width of 1.35 mm supports high-density mounting on PCBs, making it ideal for miniaturized electronic applications.

Length: 1.7 mm

The compact length of 1.7 mm allows designers to effectively optimize space, accommodating more components in limited-area circuits.

Temperature Grade: INDUSTRIAL

Being industrial-grade assures that the product meets rigorous performance standards, which is key for reliability in demanding environments.

Terminal Form: NO LEAD

No lead design minimizes footprint and supports modern PCB design techniques, contributing to environmentally friendly manufacturing.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm is advantageous for high-density applications, allowing for more connections without increasing space requirements.

Technical Specifications

Other Function Consumer ICs IP3253CZ8-4-TTL attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1.35 mm

Trade Compliance

IP3253CZ8-4-TTL General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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