Loading...

IP3254CZ12-6-TTL

NXP Semiconductors

IP3254CZ12-6-TTL by NXP Semiconductors

IP3254CZ12-6-TTL by NXP Semiconductors is a compact consumer IC designed for industrial applications. It features a dual terminal configuration, operates b/w -40 °C to 85 °C, and has a very thin profile of just 0.55mm height. Ideal for space-constrained environments, it ensures reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,439

-

-

-

-

Digiode

USA . 3,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,411

-

-

-

-

Anansix

USA . 1,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,253

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 5,140 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

5,140

$3.600

-

-

-

One Stop Electronics

USA . 1,491 parts In-Stock

1+ parts

$19.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,491

$19.800

-

-

-

UNI Independent Distributors

Spain . 6,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,263

-

-

-

-

Corphita

USA . 1,216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,216

-

-

-

-

Supply Digital

USA . 635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

635

-

-

-

-

Overview

Unlock unparalleled performance with the IP3254CZ12-6-TTL from NXP Semiconductors! Renowned for their commitment to innovation and quality, NXP delivers a consumer IC that excels in reliability across diverse applications. Its compact design ensures seamless integration into your projects, while its robust temperature range guarantees optimal functionality in any environment. Experience enhanced efficiency and peace of mind with this exceptional component—where technology meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides excellent durability and resistance to environmental conditions, making it suitable for diverse applications.

Surface Mount: YES

Being surface mount allows for compact design and easier integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, facilitating denser layouts and efficient use of board real estate.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliability and performance for everyday electronics.

No. of Terminals: 12

With 12 terminals, this IC offers a balance of complexity and versatility for various connection configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This style allows for effective heat dissipation while minimizing overall size, making it ideal for compact devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in relatively warm environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in harsh conditions, making it suitable for industrial applications.

Terminal Position: DUAL

Dual terminal positioning adds design flexibility, allowing engineers to optimize layout for signal integrity.

Maximum Seated Height: 0.55 mm

A low seated height facilitates low-profile designs, making it a great option for space-constrained applications.

Width: 1.35 mm

A narrow width keeps the footprint small, which is advantageous for compact and portable devices.

Length: 2.5 mm

The limited length aids in fitting within tight design specifications without compromising functionality.

Temperature Grade: INDUSTRIAL

Grade-rated for industrial use, this IC is built to withstand demanding environments while maintaining performance.

Terminal Form: NO LEAD

No lead design reduces parasitic inductance and capacitance, enhancing electrical performance and reliability.

Terminal Pitch: 0.4 mm

A fine terminal pitch allows for high-density designs, making it an excellent choice for modern electronics with limited board space.

Technical Specifications

Other Function Consumer ICs IP3254CZ12-6-TTL attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-N12

Length:

2.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1.35 mm

Trade Compliance

IP3254CZ12-6-TTL General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19