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HEF4050BP,652

NXP Semiconductors

HEF4050BP,652 by NXP Semiconductors

HEF4050BP,652 by NXP Semiconductors is a CMOS Logic Gates IC with 6 functions and 110 ns propagation delay at 5V. It operates in industrial temperature range (-40 to 85 °C) and has a package style of IN-LINE. Ideal for applications requiring fast signal processing in electronic circuits.

Median Price

$1.090

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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EXC GmbH

Germany . 22 parts In-Stock

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Vyrian

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Digiode

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Diverse Electronics

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Anansix

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Nova Conductors

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LIBRA Elektronik GmbH

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ACDS - Activité Composants Distribution Service

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Microchip USA

USA . 331 parts In-Stock

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$10.484

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AZTECH Wire

Italy . 972 parts In-Stock

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Corohmni

South Africa . 406 parts In-Stock

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Modulus Dynamics

Lithuania . 2,692 parts In-Stock

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Ampacity Inc.

Singapore . 1,347 parts In-Stock

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One Stop Electronics

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Argo Parts USA

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Continental Prestige Electronics

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Perfect Parts

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Aranea Global

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Cyclops Electronics Ltd (Excess)

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Overview

Upgrade your electronic projects with the HEF4050BP,652 by NXP Semiconductors. Known for their top-notch quality and reliability, NXP Semiconductors delivers exceptional logic gates that guarantee superior performance. The HEF4050BP,652 is a versatile component suitable for a wide range of applications, offering customers unmatched value and benefits. Experience seamless functionality, fast propagation delay, and precise operation with this premium product. Elevate your projects with the HEF4050BP,652 and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the logic gates, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 110 ns

Fast propagation delay allows for quick signal processing, making the logic gates suitable for high-speed operations.

No. of Functions: 6

Having multiple functions in one package increases efficiency and saves space in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

Can handle a moderate load capacitance, ensuring stable performance in various circuit configurations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates HEF4050BP,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Additional Features:

CMOS-TTL LEVEL TRANSLATOR

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

21.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

BULK

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

110 ns

Propagation Delay (tpd):

70 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.7 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF4050BP,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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