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FI1236MK2/HM/F

NXP Semiconductors

FI1236MK2/HM/F by NXP Semiconductors

VIDEO TUNER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,019 parts In-Stock

1+ parts

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3,019

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Anansix

USA . 384 parts In-Stock

1+ parts

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384

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Digiode

USA . 311 parts In-Stock

1+ parts

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311

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,304 parts In-Stock

1+ parts

$5.800

100+ parts

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1,304

$5.800

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Corphita

USA . 2,283 parts In-Stock

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2,283

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UNI Independent Distributors

Spain . 876 parts In-Stock

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876

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Native Components

USA . 432 parts In-Stock

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432

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Northwest PG Solutions

USA . 84 parts In-Stock

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84

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Technical Specifications

Silicon Tuner ICs FI1236MK2/HM/F attributes and parameters. Explore more Silicon Tuner ICs devices from NXP Semiconductors

Specs

Additional Features:

ALSO AVAILABLE FREQUENCY RANGES 163.25 MHZ-451.25 MHZ & 55.25 MHZ-157.25 MHZ

Built-in IF Amplifier (IF):

YES

General IC Type:

Maximum Input Frequency (RF):

801.25 MHz

Minimum Input Frequency (RF):

457.25 MHz

JESD-30 Code:

R-XDMA-T12

No. of Bands:

3

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

FI1236MK2/HM/F General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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