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TDA18253HN/C1

NXP Semiconductors

TDA18253HN/C1 by NXP Semiconductors

VIDEO TUNER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,605 parts In-Stock

1+ parts

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1k+ parts

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2,605

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Vyrian

USA . 2,414 parts In-Stock

1+ parts

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2,414

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Anansix

USA . 1,499 parts In-Stock

1+ parts

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1,499

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LWI Electronics Inc

India . 14 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,619 parts In-Stock

1+ parts

$6.800

100+ parts

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10k+ parts

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1,619

$6.800

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Kepictronics

USA . 15,950 parts In-Stock

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15,950

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UNI Independent Distributors

Spain . 6,780 parts In-Stock

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6,780

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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A-Z Elektronik GmbH

Germany . 2,508 parts In-Stock

1+ parts

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2,508

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Metaverse IC Inc.

Canada . 2,360 parts In-Stock

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2,360

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Perfect Parts

USA . 1,821 parts In-Stock

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1,821

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Corphita

USA . 1,475 parts In-Stock

1+ parts

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1,475

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GreenTree Electronics

Israel . 360 parts In-Stock

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360

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Technical Specifications

Silicon Tuner ICs TDA18253HN/C1 attributes and parameters. Explore more Silicon Tuner ICs devices from NXP Semiconductors

Specs

Built-in IF Amplifier (IF):

NO

General IC Type:

Maximum Input Frequency (RF):

1002 MHz

Minimum Input Frequency (RF):

54 MHz

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

Nominal Noise Figure:

7 dB

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TDA18253HN/C1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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