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TDA18260HN/C1

NXP Semiconductors

TDA18260HN/C1 by NXP Semiconductors

TDA18260HN/C1 from NXP Semiconductors is a versatile video tuner IC designed for surface mount applications. It features a compact 48-terminal chip carrier package, ensuring efficient space utilization. Ideal for digital TV and multimedia devices, it delivers high performance in a plastic/epoxy body.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,487 parts In-Stock

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4,487

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Cyclops Electronics Ltd

UK . 4,000 parts In-Stock

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4,000

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Anansix

USA . 2,657 parts In-Stock

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Digiode

USA . 1,519 parts In-Stock

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1,519

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Distributors (Availability)

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One Stop Electronics

USA . 973 parts In-Stock

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$14.800

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973

$14.800

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UNI Independent Distributors

Spain . 7,904 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,535 parts In-Stock

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4,535

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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S.R.D Solutions

India . 3,000 parts In-Stock

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Assy Fe

Spain . 2,861 parts In-Stock

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Perfect Parts

USA . 1,821 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,541 parts In-Stock

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Overview

Elevate your audio-visual experience with the TDA18260HN/C1 from NXP Semiconductors, a leader in innovative solutions. This cutting-edge silicon tuner IC ensures exceptional signal clarity and reliability, making it ideal for digital TV and set-top box applications. With its compact design and superior performance, you can trust this product to deliver seamless connectivity and enhance user satisfaction, proving invaluable for manufacturers seeking quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device (SMD) allows for compact design and easier integration into modern electronics, saving valuable board space.

Package Shape: SQUARE

The square package shape optimizes space on PCBs and facilitates efficient thermal and electrical performance.

General IC Type: VIDEO TUNER

As a video tuner IC, this product is specifically designed for high-quality video signal processing, making it ideal for television and multimedia applications.

No. of Terminals: 48

With 48 terminals, this IC offers extensive connectivity options, accommodating complex functionalities and enhancing overall system performance.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides excellent thermal dissipation and allows for efficient performance in high-frequency applications.

Terminal Position: QUAD

The quad terminal position ensures a balanced layout, improving signal integrity and minimizing noise in high-speed applications.

Terminal Form: NO LEAD

The no-lead configuration enhances the ability to mount in compact spaces while providing high reliability and excellent performance even in demanding environments.

Technical Specifications

Silicon Tuner ICs TDA18260HN/C1 attributes and parameters. Explore more Silicon Tuner ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N48

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

TDA18260HN/C1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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