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LV24250LS-TLM-E

Onsemi

LV24250LS-TLM-E by Onsemi

LV24250LS-TLM-E by Onsemi is a Silicon Tuner IC in PLASTIC/EPOXY package. It operates at -20 to 70 °C with 3V supply, demodulating FM signals. With 24 terminals in a SQUARE shape, it's ideal for AUDIO TUNER applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,680 parts In-Stock

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4,680

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Digiode

USA . 2,208 parts In-Stock

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2,208

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AZTECH Wire

Italy . 1,086 parts In-Stock

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$22.030

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1,086

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TANS Electronics

Latvia . 8,124 parts In-Stock

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SupplyDigital Components

Austria . 7,940 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,724 parts In-Stock

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Kulean Microsystems

USA . 2,308 parts In-Stock

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Corphita

USA . 2,012 parts In-Stock

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Kepictronics

USA . 610 parts In-Stock

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610

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UHIMA Technologies

Türkiye . 458 parts In-Stock

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Corohmni

South Africa . 384 parts In-Stock

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Futuretech Components

Singapore . 200 parts In-Stock

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Overview

Unlock a world of crystal-clear audio with the LV24250LS-TLM-E Silicon Tuner IC by Onsemi. Crafted with precision and expertise, this innovative product offers unparalleled performance and reliability. Ideal for a wide range of applications, this Audio Tuner IC is designed to meet your every need. With a focus on quality and cutting-edge technology, Onsemi delivers a product that exceeds expectations. Experience the value and benefits of superior sound quality and seamless integration with the LV24250LS-TLM-E. Elevate your audio experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for IC packages due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components.

Package Shape: SQUARE

Square packages are often preferred for their space-saving design and ease of handling.

General IC Type: AUDIO TUNER

An audio tuner IC is specifically designed for tuning audio signals, ensuring high-quality sound output.

Power Supplies (V): 3

Operating at a voltage of 3V helps optimize power consumption while providing sufficient power for the IC's operation.

No. of Terminals: 24

Having a sufficient number of terminals allows for proper connectivity and communication within the circuit.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer reliable protection for the IC and facilitate easy integration into circuit boards.

Maximum Operating Temperature: 70 °C

Being able to operate at temperatures up to 70 °C ensures stable performance in various environmental conditions.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20 °C enhances the versatility and reliability of the IC.

Terminal Position: QUAD

Quad terminals provide multiple connection points, enabling efficient signal transmission and reception.

Demodulation Type: FM

Frequency modulation (FM) demodulation allows for high-fidelity audio reception with minimal interference.

Temperature Grade: COMMERCIAL

Having a commercial temperature grade indicates suitability for standard commercial applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and energy efficiency.

Terminal Form: NO LEAD

No lead terminals simplify the assembly process and reduce the risk of solder-related issues.

Maximum Supply Current: 17 mA

With a maximum supply current of 17 mA, the IC operates efficiently without drawing excessive power.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm allows for compact design and precise positioning of the terminals on the IC.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC is moderately sensitive to moisture, requiring standard handling and storage precautions.

Technical Specifications

Silicon Tuner ICs LV24250LS-TLM-E attributes and parameters. Explore more Silicon Tuner ICs devices from Onsemi

Specs

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

S-PQCC-N24

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.14SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

17 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

LV24250LS-TLM-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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