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TDA7540N

STMicroelectronics

TDA7540N by STMicroelectronics

TDA7540N by STMicroelectronics is a versatile audio tuner IC featuring a built-in IF amplifier and operates within -40 °C to 85°C. It supports 2 bands, has an 80-terminal flatpack design, and requires a supply voltage of 7.7V to 9V. Ideal for industrial audio applications, it ensures low noise with a nominal figure of 12 dB.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 9,276 parts In-Stock

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Vyrian

USA . 4,827 parts In-Stock

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Digiode

USA . 2,472 parts In-Stock

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Anansix

USA . 374 parts In-Stock

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IDEA Electronic Components Group

UK . 724 parts In-Stock

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$3.041

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$2.737

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724

$3.041

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$2.737

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MKK Technologies

India . 1,622 parts In-Stock

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$5.718

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DigiPath Technology Company

USA . 1,622 parts In-Stock

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$5.718

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AZTECH Wire

Italy . 252 parts In-Stock

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$12.130

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Metaverse IC Inc.

Canada . 7,549 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,141 parts In-Stock

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Kepictronics

USA . 5,549 parts In-Stock

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Parana Technologies

USA . 2,108 parts In-Stock

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Corphita

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Overview

Unlock superior audio performance with the TDA7540N from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality silicon tuner IC is designed for a range of applications, ensuring crystal-clear sound and reliable connectivity. Its low-profile, surface-mount design saves space while delivering exceptional durability and efficiency. Experience enhanced audio quality that elevates any electronic device, making it the ideal choice for manufacturers seeking to stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection from environmental factors, making the IC suitable for various applications.

Built-in IF Amplifier (IF): YES

Having a built-in IF amplifier allows for improved signal processing and amplification, enhancing overall performance in audio applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient space utilization on PCBs, making it ideal for modern electronic devices.

Package Shape: SQUARE

The square package shape provides ease of mounting and optimized layout possibilities in circuit designs.

General IC Type: AUDIO TUNER

Designed specifically for audio applications, this IC ensures high-quality reception and processing of audio signals.

No. of Terminals: 80

A higher number of terminals provides flexibility in circuit design and the ability to integrate multiple functions within the IC.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style is advantageous for space-constrained designs while maintaining robust performance.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this IC suitable for industrial environments, ensuring reliability and longevity.

No. of Bands: 2

Dual band capability allows for versatility in tuning different frequency ranges, enhancing functionality in audio applications.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this IC is suitable for extreme environmental conditions, ensuring consistent performance.

Terminal Position: QUAD

Quad terminal position allows for efficient routing and connections on PCBs, simplifying the integration process.

Maximum Seated Height: 1.6 mm

A low seated height contributes to reduced overall device thickness, making it perfect for slim electronic designs.

Width: 14 mm

The compact width enables efficient placement on standard circuit boards, optimizing space utilization.

Minimum Supply Voltage (Vsup): 7.7 V

A lower minimum supply voltage allows for compatibility with a variety of power systems, enhancing flexibility in design.

Nominal Noise Figure: 12 dB

A low noise figure ensures high-quality audio signals by minimizing interference, contributing to clearer audio performance.

Length: 14 mm

The short length of the IC aids in compact designs, making it suitable for portable and space-sensitive applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees performance reliability in demanding environments, making this IC a trusted choice for professional applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS processes, resulting in efficient power usage and high-speed operation.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve the mechanical stability of the IC when mounted on the PCB.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for denser component placement on PCBs, making this IC suitable for modern compact electronics.

Maximum Supply Voltage (Vsup): 9 V

The reasonable maximum supply voltage ensures compatibility with common power sources, providing flexibility in circuit design.

Technical Specifications

Silicon Tuner ICs TDA7540N attributes and parameters. Explore more Silicon Tuner ICs devices from STMicroelectronics

Specs

Built-in IF Amplifier (IF):

YES

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

Nominal Noise Figure:

12 dB

No. of Bands:

2

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

7.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TDA7540N General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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