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LV25200M

Onsemi

LV25200M by Onsemi

LV25200M by Onsemi is a Silicon Tuner IC with built-in IF amplifier, suitable for audio tuner applications. It features 80 terminals in a square package style, operating temperature range of -40 to 85 °C, and BICMOS technology. With surface mount capability and compact dimensions of 14mm x 14mm x 3mm, it offers versatile integration options for industrial-grade projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,469 parts In-Stock

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Digiode

USA . 2,365 parts In-Stock

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2,365

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TANS Electronics

Latvia . 6,226 parts In-Stock

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Problanco Electronics

Mexico . 6,045 parts In-Stock

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SupplyDigital Components

Austria . 6,024 parts In-Stock

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Kulean Microsystems

USA . 3,984 parts In-Stock

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Corphita

USA . 898 parts In-Stock

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UHIMA Technologies

Türkiye . 761 parts In-Stock

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Corohmni

South Africa . 238 parts In-Stock

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Overview

Enhance your audio experience with the LV25200M Silicon Tuner IC by Onsemi. With a built-in IF amplifier, this high-quality product offers superior performance and reliability. Designed for various applications, this square-shaped tuner is ideal for audio systems that demand precision and efficiency. Experience crystal-clear sound and seamless tuning capabilities with the LV25200M. Upgrade your audio equipment today and enjoy the benefits of Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and durable, making the product easy to handle and resistant to damage during transportation and handling.

Built-in IF Amplifier (IF): YES

Having a built-in IF amplifier eliminates the need for external components, simplifying the design and reducing overall system cost.

Surface Mount: YES

Surface mount capability enables easy and efficient assembly onto PCBs, saving space and reducing production time.

Package Shape: SQUARE

Square package shape provides stability and uniformity during mounting and ensures efficient use of board space.

General IC Type: AUDIO TUNER

Specifically designed for audio tuning applications, ensuring optimal performance and functionality in audio-related systems.

No. of Terminals: 80

High number of terminals allow for versatile connections and integration into complex circuit designs.

Package Style (Meter): FLATPACK

Flatpack package style offers a slim profile and easy integration into compact electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in various environmental conditions.

No. of Bands: 4

Support for multiple bands allows for flexible tuning options and compatibility with different broadcasting standards.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance ensures functionality in cold environments without compromising performance.

Terminal Position: QUAD

Quad terminal position offers efficient connectivity and soldering options for reliable connections in the circuit.

Maximum Seated Height: 3 mm

Low seated height enables a compact design and facilitates installation in space-constrained applications.

Width: 14 mm

Optimal width dimension facilitates ease of PCB layout and integration into electronic systems.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement ensures energy efficiency and compatibility with various power sources.

Length: 14 mm

Ideal length dimension allows for compact placement on the PCB and efficient use of board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with temperature fluctuations.

Technology: BICMOS

Utilization of BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections during soldering and ensures mechanical stability in the circuit.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density packaging and efficient use of board space in compact electronic designs.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance supports a wide range of power sources and ensures stability in voltage input variations.

Technical Specifications

Silicon Tuner ICs LV25200M attributes and parameters. Explore more Silicon Tuner ICs devices from Onsemi

Specs

Additional Features:

IT ALSO REQUIRES 7.5V TO 8.5V SUPPLY

Built-in IF Amplifier (IF):

YES

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Bands:

4

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

3 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LV25200M General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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