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SN761677DBTRG4

Texas Instruments

SN761677DBTRG4 by Texas Instruments

Texas Instruments SN761677DBTRG4 is a Silicon Tuner IC with built-in IF amplifier, operating at 55.25-801.25 MHz RF range. Ideal for video tuner applications, it features 38 terminals in a small outline package with 5V supply voltage and 11dB noise figure.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,067 parts In-Stock

1+ parts

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4,067

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Vyrian

USA . 3,669 parts In-Stock

1+ parts

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3,669

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 112 parts In-Stock

1+ parts

$1.681

100+ parts

-

1k+ parts

$2.283

10k+ parts

-

112

$1.681

-

$2.283

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DigiPath Technology Company

USA . 1,757 parts In-Stock

1+ parts

$1.851

100+ parts

$1.703

1k+ parts

-

10k+ parts

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1,757

$1.851

$1.703

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IDEA Electronic Components Group

UK . 1,271 parts In-Stock

1+ parts

$1.889

100+ parts

-

1k+ parts

$1.700

10k+ parts

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1,271

$1.889

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$1.700

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ChromeModa Solutions

Germany . 1,044 parts In-Stock

1+ parts

$1.889

100+ parts

$1.549

1k+ parts

-

10k+ parts

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1,044

$1.889

$1.549

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AZTECH Wire

Italy . 603 parts In-Stock

1+ parts

$5.324

100+ parts

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603

$5.324

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One Stop Electronics

USA . 1,480 parts In-Stock

1+ parts

$10.800

100+ parts

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1,480

$10.800

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Corphita

USA . 2,252 parts In-Stock

1+ parts

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2,252

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Overview

Unlock a world of crystal-clear television viewing with the SN761677DBTRG4 Silicon Tuner IC by Texas Instruments. Crafted with precision and expertise, this video tuner offers unparalleled performance and reliability in a compact package. Whether you're watching your favorite show or streaming content online, this tuner ensures exceptional signal reception and picture quality. Trust Texas Instruments to deliver cutting-edge technology that enhances your entertainment experience. Elevate your TV viewing experience with the SN761677DBTRG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the IC lightweight and durable, ensuring easy handling and reliability.

Built-in IF Amplifier (IF): YES

Having a built-in IF amplifier eliminates the need for external amplification components, simplifying the design and reducing overall system cost.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

General IC Type: VIDEO TUNER

This specialized IC type is designed specifically for video tuning applications, ensuring high performance and compatibility with video signals.

Minimum Input Frequency (RF): 55.25 MHz

The low minimum input frequency allows for the tuning of a wide range of RF signals, making it versatile for various applications.

Power Supplies (V): 5

Operating at a standard 5V power supply simplifies the power management aspect and ensures compatibility with common power sources.

No. of Terminals: 38

Having a larger number of terminals provides more connectivity options and flexibility in the circuit design, accommodating various system requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and thin package style allows for space-efficient PCB layout, ideal for compact electronic devices and reducing overall system size.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand elevated temperatures during operation, ensuring reliable performance in demanding environments.

No. of Bands: 3

Support for multiple bands enhances the IC's tuning capabilities, making it suitable for different frequency ranges and applications.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows for operation in cold environments, ensuring versatility and reliability in a wide range of conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and conductivity, improving the overall reliability and longevity of the IC.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in PCB layout and allows for different mounting configurations, enhancing design possibilities.

Maximum Seated Height: 1.2 mm

The low seated height makes the IC suitable for applications with space constraints, allowing for compact and slim designs.

Width: 4.4 mm

The narrow width of the IC enables tight PCB layout designs, saving space and enabling more compact electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

With a low minimum supply voltage, the IC can operate efficiently even with limited power sources, increasing its versatility in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds ensures proper soldering and assembly during production, enhancing reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for robust soldering processes, ensuring secure connections and reliability in solder joints.

Nominal Noise Figure: 11 dB

The low nominal noise figure indicates high sensitivity and signal quality, making the IC ideal for applications requiring clear and crisp video signals.

Length: 9.7 mm

The compact length of the IC contributes to a smaller overall footprint, making it suitable for space-constrained electronic devices.

Technology: BIPOLAR

The bipolar technology used in the IC offers high performance and reliability, ensuring robust operation and compatibility with various systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable soldering connections, enhancing the overall durability and performance of the IC.

Maximum Supply Current: 105 mA

Operating at a maximum supply current of 105 mA ensures efficient power consumption, making the IC suitable for energy-efficient designs.

Maximum Input Frequency (RF): 801.25 MHz

With a high maximum input frequency, the IC can handle a wide range of RF signals, enabling compatibility with various communication standards.

Terminal Pitch: 0.5 mm

The narrow terminal pitch allows for densely packed terminal connections, optimizing PCB layout and maximizing connectivity in a limited space.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates the IC's ability to withstand moderate exposure to moisture during storage and handling, ensuring reliability.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, the IC can handle higher voltage inputs without risking damage, enhancing its versatility in different operating conditions.

Technical Specifications

Silicon Tuner ICs SN761677DBTRG4 attributes and parameters. Explore more Silicon Tuner ICs devices from Texas Instruments

Specs

Built-in IF Amplifier (IF):

YES

General IC Type:

Maximum Input Frequency (RF):

801.25 MHz

Minimum Input Frequency (RF):

55.25 MHz

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

Nominal Noise Figure:

11 dB

No. of Bands:

3

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

105 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN761677DBTRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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