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SN761677DARG4

Texas Instruments

SN761677DARG4 by Texas Instruments

SN761677DARG4 by Texas Instruments is a Silicon Tuner IC with built-in IF amplifier, operating at 55.25-801.25 MHz RF frequency range. It features a 38-terminal small outline package suitable for video tuner applications in temperatures ranging from -20 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,134 parts In-Stock

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4,134

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Digiode

USA . 1,139 parts In-Stock

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1,139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,725 parts In-Stock

1+ parts

$3.043

100+ parts

-

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$3.556

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1,725

$3.043

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$3.556

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IDEA Electronic Components Group

UK . 2,184 parts In-Stock

1+ parts

$3.419

100+ parts

-

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$3.077

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2,184

$3.419

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$3.077

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ChromeModa Solutions

Germany . 1,537 parts In-Stock

1+ parts

$3.419

100+ parts

$2.804

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1,537

$3.419

$2.804

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One Stop Electronics

USA . 1,472 parts In-Stock

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$15.800

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1,472

$15.800

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AZTECH Wire

Italy . 623 parts In-Stock

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$18.555

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623

$18.555

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Microchip USA

USA . 5,469 parts In-Stock

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5,469

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A-Z Elektronik GmbH

Germany . 4,910 parts In-Stock

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4,910

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Corphita

USA . 2,495 parts In-Stock

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2,495

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DigiPath Technology Company

USA . 1,116 parts In-Stock

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$3.083

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1,116

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$3.083

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Overview

Discover the cutting-edge SN761677DARG4 by Texas Instruments, a high-quality Silicon Tuner IC designed to enhance your video tuner applications. With built-in IF amplifier and surface mount capabilities, this product offers exceptional performance and reliability. The compact package shape and superior technology make it a top choice for various electronic devices. Trust in Texas Instruments' renowned expertise to bring you the best value and benefits with this state-of-the-art component. Elevate your projects with the SN761677DARG4 and experience unmatched quality and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and cost-effective, making the product long-lasting and affordable.

Built-in IF Amplifier (IF): YES

Having a built-in IF amplifier eliminates the need for an external amplifier, reducing overall component count and simplifying the design.

Surface Mount: YES

Being surface mountable makes the product easy to integrate onto circuit boards, saving space and improving manufacturability.

General IC Type: VIDEO TUNER

Being a video tuner IC makes this product suitable for applications involving video signal processing, ensuring high-quality video output.

Minimum Input Frequency (RF): 55.25 MHz

With a low minimum input frequency, the product can support a wide range of RF signals, making it versatile for various applications.

Power Supplies (V): 5

Operating at 5V makes the product compatible with standard power sources, simplifying power management.

No. of Terminals: 38

Having a high number of terminals allows for more connectivity options, making the product versatile in different circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves space on the PCB and enhances the product's overall aesthetics.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated temperatures, improving reliability in demanding environments.

No. of Bands: 3

Supporting multiple bands allows the product to tune into different frequency ranges, making it versatile for various signal sources.

Minimum Operating Temperature: -20 °C

Operating at low temperatures ensures the product's functionality in cold environments, suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish offers excellent corrosion resistance and ensures reliable electrical connections, enhancing the product's lifespan.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in PCB layout and allows for different soldering configurations.

Maximum Seated Height: 1.2 mm

The low seated height is suitable for compact designs and enables a slim profile for the overall product.

Width: 6.1 mm

The narrow width enables the product to be easily integrated into tight spaces on the PCB, optimizing board real estate.

Minimum Supply Voltage (Vsup): 4.5 V

Supporting a low minimum supply voltage allows the product to operate in systems with limited power availability.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can endure the soldering process without degrading its performance.

Nominal Noise Figure: 11 dB

Having a low nominal noise figure ensures minimal signal degradation and maintains signal integrity, delivering high-quality output.

Length: 12.5 mm

The compact length of the product optimizes PCB space usage and allows for efficient placement in electronic devices.

Technology: BIPOLAR

Utilizing bipolar technology offers high-speed performance and precise signal processing capabilities, making the product suitable for demanding applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and inspection processes, ensuring reliable connections for the product.

Maximum Supply Current: 105 mA

With a low maximum supply current, the product consumes minimal power, contributing to energy efficiency and reducing operational costs.

Maximum Input Frequency (RF): 801.25 MHz

Supporting high input frequencies enables the product to handle a broad range of RF signals, enhancing its versatility in signal reception.

Terminal Pitch: 0.65 mm

The tight terminal pitch allows for high-density mounting and facilitates compact PCB designs, improving overall circuit efficiency.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates the product's moderate sensitivity to moisture exposure during storage and assembly, ensuring reliable performance in typical environments.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage range provides flexibility in power input options, accommodating various power sources for operation.

Technical Specifications

Silicon Tuner ICs SN761677DARG4 attributes and parameters. Explore more Silicon Tuner ICs devices from Texas Instruments

Specs

Built-in IF Amplifier (IF):

YES

General IC Type:

Maximum Input Frequency (RF):

801.25 MHz

Minimum Input Frequency (RF):

55.25 MHz

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

2

Nominal Noise Figure:

11 dB

No. of Bands:

3

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

105 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

SN761677DARG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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