Loading...

TDA7515TR

STMicroelectronics

TDA7515TR by STMicroelectronics

TDA7515TR by STMicroelectronics is a versatile audio tuner IC featuring a built-in IF amplifier for enhanced signal processing. It operates in extreme temperatures from -40 °C to 85°C and comes in a low-profile flatpack package with 44 terminals. Ideal for industrial applications, its BICMOS technology ensures reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,277

-

-

-

-

Vyrian

USA . 2,704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,704

-

-

-

-

Anansix

USA . 2,527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,527

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,169 parts In-Stock

1+ parts

$1.427

100+ parts

-

1k+ parts

$1.284

10k+ parts

-

1,169

$1.427

-

$1.284

-

MKK Technologies

India . 1,197 parts In-Stock

1+ parts

$2.683

100+ parts

-

1k+ parts

-

10k+ parts

-

1,197

$2.683

-

-

-

DigiPath Technology Company

USA . 1,197 parts In-Stock

1+ parts

$2.683

100+ parts

-

1k+ parts

-

10k+ parts

-

1,197

$2.683

-

-

-

Corphita

USA . 4,737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,737

-

-

-

-

Parana Technologies

USA . 1,346 parts In-Stock

1+ parts

-

100+ parts

$1.706

1k+ parts

-

10k+ parts

-

1,346

-

$1.706

-

-

Overview

Elevate your audio experience with the TDA7515TR from STMicroelectronics, a leader in innovation and quality. This sleek, low-profile silicon tuner IC not only delivers exceptional sound clarity but is also designed for diverse applications, from automotive to industrial systems. With robust temperature resilience and advanced features, it ensures reliability in any environment. Trust in STMicroelectronics for unparalleled performance and value that transforms your audio projects into masterpieces.

Feature Benefit Bullets

Built-in IF Amplifier: YES

The integrated IF amplifier enhances the signal quality, making this tuner IC ideal for applications requiring high audio fidelity.

Surface Mount: YES

The surface mount design allows for compact PCB layouts and better integration into modern electronic devices.

Package Shape: SQUARE

The square package shape provides balanced dimensions, making it easy to mount and integrate into various circuit designs.

General IC Type: AUDIO TUNER

As an audio tuner, this IC is specifically designed for high-performance audio applications, ensuring optimal sound performance.

No. of Terminals: 44

The 44 terminals offer a wide range of connectivity options, allowing for more functionality and flexibility in design.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style reduces the overall height of the assembly, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability and performance in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures makes this IC ideal for industrial and outdoor applications.

Terminal Position: QUAD

Quad terminal positioning allows for efficient use of space on a PCB and simplifies the layout design.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm keeps the product slim, enhancing its suitability for ultra-thin devices.

Width: 10 mm

A compact width of 10 mm makes it easy to fit in various electronic devices and systems.

Length: 10 mm

With a length of 10 mm, this IC is designed for small form factor applications where space is a premium.

Temperature Grade: INDUSTRIAL

Industrial-grade components are built to withstand rigorous environmental conditions, ensuring longevity and robustness.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, resulting in efficient performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and improved electrical contact, enhancing the reliability of the connections.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm offers a compact design while maintaining a robust connection, making it ideal for dense layouts.

Technical Specifications

Silicon Tuner ICs TDA7515TR attributes and parameters. Explore more Silicon Tuner ICs devices from STMicroelectronics

Specs

Built-in IF Amplifier (IF):

YES

General IC Type:

JESD-30 Code:

S-XQFP-G44

Length:

10 mm

No. of Bands:

1

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7515TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11