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BZA862AVL,115

NXP Semiconductors

BZA862AVL,115 by NXP Semiconductors

BZA862AVL,115 by NXP Semiconductors is a transient suppression device with 4 common anode elements. It has a max power dissipation of 6W and breakdown voltage of 6.2V. This diode type device in small outline package is ideal for protecting circuits from voltage spikes in various electronic applications.

Median Price

$0.202

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 134,158 parts In-Stock

1+ parts

-

100+ parts

$0.202

1k+ parts

$0.168

10k+ parts

$0.150

134,158

-

$0.202

$0.168

$0.150

DigiKey

USA . 134,158 parts In-Stock

1+ parts

-

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$0.250

134,158

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-

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$0.250

Verical

USA . 133,786 parts In-Stock

1+ parts

-

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$0.187

133,786

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-

$0.187

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.068

100+ parts

-

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10

$0.068

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Digiode

USA . 4,621 parts In-Stock

1+ parts

$0.072

100+ parts

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4,621

$0.072

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VNN

France . 3,960 parts In-Stock

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3,960

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Vyrian

USA . 2,392 parts In-Stock

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2,392

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Anansix

USA . 1,589 parts In-Stock

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1,589

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Distributors (Availability)

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Bastille Electronics

Australia . 30 parts In-Stock

1+ parts

$0.068

100+ parts

$0.065

1k+ parts

$0.061

10k+ parts

$0.061

30

$0.068

$0.065

$0.061

$0.061

Corphita

USA . 2,992 parts In-Stock

1+ parts

$0.068

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2,992

$0.068

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Component Stockers USA

USA . 176,739 parts In-Stock

1+ parts

$0.080

100+ parts

$0.070

1k+ parts

$0.070

10k+ parts

$0.070

176,739

$0.080

$0.070

$0.070

$0.070

Ampacity Inc.

Singapore . 133,805 parts In-Stock

1+ parts

$0.141

100+ parts

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133,805

$0.141

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AZTECH Wire

Italy . 615 parts In-Stock

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$20.610

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615

$20.610

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Continental Prestige Electronics

USA . 134,158 parts In-Stock

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$0.091

10k+ parts

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134,158

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$0.091

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Perfect Parts

USA . 6,447 parts In-Stock

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UNI Independent Distributors

Spain . 4,599 parts In-Stock

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4,599

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A-Z Elektronik GmbH

Germany . 1,250 parts In-Stock

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1,250

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Overview

Discover the BZA862AVL,115 by NXP Semiconductors, a top-quality transient suppression device that offers unparalleled protection against voltage spikes. Perfect for a wide range of applications, this product boasts a common anode configuration with 4 elements and a compact rectangular package design. With a maximum non-repetitive peak reverse power dissipation of 6W and a nominal breakdown voltage of 6.2V, the BZA862AVL,115 guarantees reliable performance even in the most demanding environments. Trust NXP Semiconductors to deliver exceptional quality and value with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and resistance to harsh environmental conditions, making this product reliable for long-term use.

Config: COMMON ANODE, 4 ELEMENTS

The common anode configuration with 4 elements allows for effective suppression of transient voltage spikes, ensuring protection for connected devices.

Surface Mount: YES

The surface mount capability of this product makes it easy to install and integrate into electronic circuits, saving time and effort during assembly.

Maximum Non Repetitive Peak Reverse Power Dissipation: 6 W

With a high maximum non-repetitive peak reverse power dissipation of 6W, this product can handle sudden high voltage spikes effectively, protecting connected components.

Nominal Breakdown Voltage: 6.2 V

The nominal breakdown voltage of 6.2V ensures that the device activates and starts to suppress voltage spikes at a level that is safe for connected electronics.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to place and solder onto circuit boards, optimizing space utilization and ensuring a neat layout.

No. of Terminals: 5

With 5 terminals, this product provides ample connections for secure mounting and efficient electrical contact, enhancing overall performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable space on the circuit board, making it suitable for compact electronic designs where size is a critical factor.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C ensures that this device can withstand elevated temperatures without compromising its performance, making it suitable for various applications.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections for long-lasting performance.

Terminal Position: DUAL

The dual terminal position allows for flexibility in mounting and connection options, making it easier to integrate this product into different circuit layouts.

Maximum Power Dissipation: 0.3 W

The low maximum power dissipation of 0.3W indicates efficient energy handling capabilities, reducing the risk of overheating and improving overall product reliability.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product can undergo soldering processes without damage, ensuring a secure and reliable assembly process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for effective soldering of the device onto circuit boards, ensuring secure electrical connections and optimal performance.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of transient voltage suppressor diodes ensures rapid response to voltage spikes, protecting connected electronics from damage and ensuring reliable operation.

Technology: AVALANCHE

The avalanche technology used in this product allows for quick and effective suppression of voltage spikes, providing robust protection for sensitive electronic components.

Terminal Form: GULL WING

The gull wing terminal form offers secure mounting and reliable electrical connections, ensuring stable performance even in demanding operating conditions.

No. of Elements: 4

With 4 elements, this product can effectively suppress transient voltage spikes from multiple sources, providing comprehensive protection for connected devices.

Polarity: UNIDIRECTIONAL

The unidirectional polarity ensures that voltage spikes are only allowed to flow in one direction, preventing damage to connected electronics and maintaining signal integrity.

Diode Element Material: SILICON

The use of silicon diode element material offers high efficiency and reliability in suppressing voltage spikes, ensuring long-term protection for electronic components.

Technical Specifications

Transient Suppression Devices BZA862AVL,115 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Nominal Breakdown Voltage:

6.2 V

Config:

COMMON ANODE, 4 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

6 W

No. of Elements:

4

No. of Terminals:

5

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.3 W

Qualification:

Not Qualified

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BZA862AVL,115 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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