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BZA856A,115

NXP Semiconductors

BZA856A,115 by NXP Semiconductors

BZA856A,115 by NXP Semiconductors is a transient suppression device with 4 common anode elements. It has a max non-repetitive peak reverse power dissipation of 24W and breakdown voltage of 5.6V. Ideal for applications requiring protection against voltage transients in compact electronic circuits.

Median Price

$0.161

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 370 parts In-Stock

1+ parts

$0.430

100+ parts

$0.165

1k+ parts

$0.110

10k+ parts

$0.079

370

$0.430

$0.165

$0.110

$0.079

Rochester

USA . 29,400 parts In-Stock

1+ parts

-

100+ parts

$0.161

1k+ parts

$0.133

10k+ parts

$0.119

29,400

-

$0.161

$0.133

$0.119

Verical

USA . 14,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.148

14,400

-

-

-

$0.148

EBV Elektronik

Germany . 9,000 parts In-Stock

1+ parts

-

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9,000

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Farnell

UK . 3,800 parts In-Stock

1+ parts

-

100+ parts

$0.192

1k+ parts

$0.128

10k+ parts

$0.107

3,800

-

$0.192

$0.128

$0.107

Element14

Singapore . 2,740 parts In-Stock

1+ parts

-

100+ parts

$0.134

1k+ parts

$0.096

10k+ parts

$0.080

2,740

-

$0.134

$0.096

$0.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,354 parts In-Stock

1+ parts

$0.058

100+ parts

-

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2,354

$0.058

-

-

-

TME

Poland . 3,000 parts In-Stock

1+ parts

$0.420

100+ parts

$0.213

1k+ parts

$0.133

10k+ parts

$0.127

3,000

$0.420

$0.213

$0.133

$0.127

Chip Stock

USA . 99,000 parts In-Stock

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-

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99,000

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Vyrian

USA . 3,422 parts In-Stock

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3,422

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Ashlea Components Ltd

UK . 2,760 parts In-Stock

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2,760

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Anansix

USA . 390 parts In-Stock

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390

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ACDS - Activité Composants Distribution Service

France . 147 parts In-Stock

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147

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,519 parts In-Stock

1+ parts

$0.055

100+ parts

-

1k+ parts

-

10k+ parts

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2,519

$0.055

-

-

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AZTECH Wire

Italy . 5,639 parts In-Stock

1+ parts

$0.130

100+ parts

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5,639

$0.130

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Native Components

USA . 1,095 parts In-Stock

1+ parts

$10.740

100+ parts

-

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1,095

$10.740

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Northwest PG Solutions

USA . 2,756 parts In-Stock

1+ parts

$11.814

100+ parts

$10.633

1k+ parts

-

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2,756

$11.814

$10.633

-

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Perfect Parts

USA . 346,080 parts In-Stock

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346,080

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Continental Prestige Electronics

USA . 50,400 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.069

10k+ parts

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50,400

-

-

$0.069

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RC Electronics

USA . 36,900 parts In-Stock

1+ parts

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36,900

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Eastek

USA . 21,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.210

10k+ parts

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21,000

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$0.210

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Kepictronics

USA . 12,500 parts In-Stock

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12,500

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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A-Z Elektronik GmbH

Germany . 1,250 parts In-Stock

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1,250

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Supply Digital

USA . 491 parts In-Stock

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491

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UNI Independent Distributors

Spain . 407 parts In-Stock

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407

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Glotronic Ltd.

UK . 118 parts In-Stock

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118

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Overview

Experience unmatched protection and reliability with the BZA856A,115 by NXP Semiconductors. As a leading manufacturer in the industry, NXP ensures top-notch quality and performance in their transient suppression devices. With a common anode configuration and 4 elements, this product is ideal for various applications where voltage spikes need to be controlled. Trust in NXP's expertise to deliver a solution that offers exceptional value, benefits, and advantages to meet all your needs. Choose the BZA856A,115 for peace of mind and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the device.

Config: COMMON ANODE, 4 ELEMENTS

Allows for efficient and effective suppression of transient voltage spikes across multiple elements, providing comprehensive protection.

Surface Mount: YES

Facilitates easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Non Repetitive Peak Reverse Power Dissipation: 24 W

Can handle high levels of power dissipation during voltage spikes, making it reliable and robust in transient suppression applications.

Nominal Breakdown Voltage: 5.6 V

Provides reliable protection by effectively clamping voltage spikes above this threshold, safeguarding sensitive electronic components.

Package Shape: RECTANGULAR

Optimizes space efficiency on circuit boards, allowing for compact and organized installations in electronic devices.

No. of Terminals: 5

Facilitates easy connectivity and integration into circuit designs, enhancing the device's versatility in various applications.

Package Style (Meter): SMALL OUTLINE

Offers a space-saving design that is suitable for compact electronic devices and applications with limited space constraints.

Terminal Finish: TIN

Provides a reliable and conductive surface for terminal connections, ensuring stable electrical contact and performance.

Terminal Position: DUAL

Allows for flexible mounting orientations and configurations, accommodating different circuit layouts and designs.

Maximum Power Dissipation: 0.335 W

Efficiently dissipates power during transient voltage events, preventing damage to sensitive components and maintaining device reliability.

Minimum Breakdown Voltage: 5.32 V

Ensures effective protection by triggering conduction at a safe threshold, diverting excess voltage away from critical components.

Maximum Time At Peak Reflow Temperature (s): 30

Sustains reliability and stability even under high-temperature reflow processes, ensuring consistent performance during assembly.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during reflow soldering, enabling secure and durable mounting on circuit boards.

Maximum Breakdown Voltage: 5.88 V

Provides an additional safety margin against voltage spikes, enhancing the device's transient suppression capabilities for added protection.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Specifically designed for suppressing transient voltages, ensuring precise and effective protection in a variety of circuit applications.

Technology: AVALANCHE

Utilizes avalanche breakdown principle for efficient and rapid clamping of voltage spikes, enhancing the device's transient suppression performance.

Terminal Form: GULL WING

Enables secure and stable soldering connections on circuit boards, ensuring reliable electrical contact and longevity of the device.

No. of Elements: 4

Consists of multiple suppression elements for enhanced protection, offering redundancy and effectiveness in mitigating transient voltage events.

Polarity: UNIDIRECTIONAL

Provides protection against transient voltages in one direction, ensuring targeted suppression of voltage spikes for specific circuit requirements.

Diode Element Material: SILICON

Utilizes silicon material known for its high-performance characteristics in transient suppression applications, ensuring reliable and efficient operation.

Technical Specifications

Transient Suppression Devices BZA856A,115 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Maximum Breakdown Voltage:

5.88 V

Minimum Breakdown Voltage:

5.32 V

Nominal Breakdown Voltage:

5.6 V

Config:

COMMON ANODE, 4 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

24 W

No. of Elements:

4

No. of Terminals:

5

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.335 W

Qualification:

Not Qualified

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BZA856A,115 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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