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BZA856AL,115

NXP Semiconductors

BZA856AL,115 by NXP Semiconductors

NXP Semiconductors BZA856AL,115 is a transient suppression device with 5.6V breakdown voltage and 16W peak reverse power dissipation. Commonly used in applications requiring protection against voltage spikes, it features a small outline package with gull wing terminals for surface mount assembly.

Median Price

$0.075

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,318 parts In-Stock

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$0.080

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$0.080

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$0.080

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Chip1Stop

Japan . 755 parts In-Stock

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$0.070

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$0.070

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755

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$0.070

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Digiode

USA . 3,351 parts In-Stock

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$0.062

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VNN

France . 17,743 parts In-Stock

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Vyrian

USA . 6,114 parts In-Stock

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Anansix

USA . 1,307 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,871 parts In-Stock

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$0.055

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Corphita

USA . 2,871 parts In-Stock

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$0.058

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Corohmni

South Africa . 102 parts In-Stock

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$0.181

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AZTECH Wire

Italy . 1,059 parts In-Stock

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$11.510

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Assy Fe

Spain . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,710 parts In-Stock

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UNI Independent Distributors

Spain . 2,517 parts In-Stock

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Aranea Global

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A-Z Elektronik GmbH

Germany . 1,190 parts In-Stock

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Continental Prestige Electronics

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Overview

Enhance the performance of your electronic devices with the NXP Semiconductors BZA856AL,115 Transient Suppression Device. Manufactured by a trusted industry leader, this common anode diode offers superior protection against voltage spikes, ensuring the longevity of your equipment. With its compact design and high power dissipation capabilities, this diode is ideal for a wide range of applications. Invest in quality and reliability with the BZA856AL,115 and enjoy peace of mind knowing your electronics are safeguarded from harmful surges.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the transient suppression device, ensuring long-term reliability.

Config: COMMON ANODE, 4 ELEMENTS

Common anode configuration with 4 elements allows for effective transient suppression and protection against voltage spikes or surges.

Surface Mount: YES

Surface mount capability enables easy and convenient installation of the transient suppression device onto circuit boards, saving space and reducing assembly time.

Maximum Non Repetitive Peak Reverse Power Dissipation: 16 W

High maximum non-repetitive peak reverse power dissipation rating ensures that the device can handle sudden power surges or spikes without getting damaged.

Nominal Breakdown Voltage: 5.6 V

Nominal breakdown voltage of 5.6 V provides effective protection against overvoltage conditions, ensuring the safety of connected electronic components.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into circuit layouts and provides a standardized form factor for compatibility with various applications.

No. of Terminals: 5

Having 5 terminals provides multiple connection points for secure and stable installation of the transient suppression device within the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and is suitable for compact electronic devices where size is a constraint.

Terminal Finish: TIN

Tin terminal finish enhances the solderability of the device, ensuring reliable electrical connections during assembly and improving overall performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting options and allows for versatile installation in different orientations based on the circuit design.

Maximum Power Dissipation: 0.3 W

Low maximum power dissipation minimizes heat generation and energy loss, improving the efficiency and effectiveness of the transient suppression device.

Maximum Time At Peak Reflow Temperature (s): 30

Ability to withstand peak reflow temperatures for up to 30 seconds ensures reliable soldering during assembly without compromising the device's performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C enables the transient suppression device to endure the soldering process and maintain its integrity under extreme heat conditions.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Trans voltage suppressor diode type offers efficient voltage clamping and transient suppression capabilities, safeguarding sensitive electronic components from voltage spikes.

Technology: AVALANCHE

Avalanche technology enhances the device's ability to handle high energy transient events by quickly clamping and dissipating excess voltage, providing reliable protection for connected circuits.

Terminal Form: GULL WING

Gull wing terminal form facilitates secure and reliable soldering connections during assembly, ensuring stable electrical contact and preventing signal interference.

No. of Elements: 4

Having 4 elements increases the device's transient suppression capability and allows for effective protection against multiple voltage transients simultaneously.

Polarity: UNIDIRECTIONAL

Unidirectional polarity ensures that the transient suppression device only conducts in one direction, providing consistent and reliable voltage clamping performance in the intended orientation.

Diode Element Material: SILICON

Silicon diode element material offers high performance and durability in transient suppression applications, providing efficient voltage clamping and protection against electrical disturbances.

Technical Specifications

Transient Suppression Devices BZA856AL,115 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Nominal Breakdown Voltage:

5.6 V

Config:

COMMON ANODE, 4 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

16 W

No. of Elements:

4

No. of Terminals:

5

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.3 W

Qualification:

Not Qualified

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BZA856AL,115 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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