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BUK9E3R2-40B,127

NXP Semiconductors

BUK9E3R2-40B,127 by NXP Semiconductors

BUK9E3R2-40B,127 by NXP Semiconductors is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 100A Max ID. Ideal for SWITCHING applications, it features a built-in DIODE, 888A IDM, and 0.0035 ohm RDS(on). Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 300W and can withstand up to 175°C.

Median Price

$2.745

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$2.590

1k+ parts

$2.320

10k+ parts

$2.180

300

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$2.590

$2.320

$2.180

Verical

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

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$2.900

10k+ parts

$2.725

300

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$2.900

$2.725

Distributors (In-Stock)

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Digiode

USA . 4,623 parts In-Stock

1+ parts

$1.406

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4,623

$1.406

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Vyrian

USA . 2,358 parts In-Stock

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Anansix

USA . 1,420 parts In-Stock

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1,420

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ACDS - Activité Composants Distribution Service

France . 250 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 728 parts In-Stock

1+ parts

$0.210

100+ parts

-

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$0.202

728

$0.210

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$0.202

Northwest PG Solutions

USA . 473 parts In-Stock

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$0.231

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$0.204

473

$0.231

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$0.204

Corphita

USA . 105 parts In-Stock

1+ parts

$1.332

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105

$1.332

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Microchip USA

USA . 4,713 parts In-Stock

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$9.230

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4,713

$9.230

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AZTECH Wire

Italy . 37 parts In-Stock

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$17.820

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QUARKTWIN TECHNOLOGY LTD

USA . 21,058 parts In-Stock

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UNI Independent Distributors

Spain . 7,821 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Continental Prestige Electronics

USA . 300 parts In-Stock

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$1.780

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$1.780

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Cyclops Electronics Ltd (Excess)

UK . 250 parts In-Stock

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Overview

Looking for top-quality Power Field Effect Transistors? Look no further than the BUK9E3R2-40B,127 by NXP Semiconductors. With a reputation for excellence in semiconductor manufacturing, NXP delivers reliable and efficient components for various applications, including switching functions. The BUK9E3R2-40B,127 offers unparalleled value with its single configuration and built-in diode, making it a standout choice for your power needs. Trust NXP to provide cutting-edge technology and superior performance with the BUK9E3R2-40B,127.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher transconductance compared to P-channel FETs, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse current flow, enhancing the overall reliability of the system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient power handling capabilities.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40 V, this FET can handle higher voltage levels safely without the risk of damage.

Maximum Pulsed Drain Current (IDM): 888 A

The high pulsed drain current rating of 888 A allows this FET to handle large current spikes without overheating or failing.

Maximum Power Dissipation (Abs): 300 W

With a maximum power dissipation of 300 W, this FET can handle high power levels efficiently without overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C ensures reliable operation even in high-temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) BUK9E3R2-40B,127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Avalanche Energy Rating (EAS):

1200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

888 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BUK9E3R2-40B,127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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