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BUK101-50GL

NXP Semiconductors

BUK101-50GL by NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: THROUGH-HOLE; No. of Terminals: 3; Package Code: TO-220; Package Shape: RECTANGULAR; Nominal Output Peak Current Limit: 100 A;

Median Price

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Lifecycle Status

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13

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1k+

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VNN

France . 4,705 parts In-Stock

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Digiode

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Anansix

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Huijzer Components

Netherlands . 201 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 50 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

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North Shore Components

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Standard Data Resources

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Corel Iberica Componentes, S.L.

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Century Electronics Ltd.

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Ashlea Components Ltd

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Corohmni

South Africa . 224 parts In-Stock

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One Stop Electronics

USA . 848 parts In-Stock

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Continental Prestige Electronics

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Corphita

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Benley Electronics

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Perfect Parts

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Assy Fe

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Technical Specifications

Peripheral Drivers BUK101-50GL attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

TRANSIENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

3

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

100 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

BUK101-50GL Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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