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BUK1M200-50SGTD,11

NXP Semiconductors

BUK1M200-50SGTD,11 by NXP Semiconductors

The NXP Semiconductors BUK1M200-50SGTD,11 is a peripheral driver with 4 functions and built-in protections against transient, over current, over voltage, and thermal issues. It features a small outline package style with 20 terminals in gull wing form. This interface IC type has a turn-on time of 12 us and turn-off time of 65 us, suitable for applications requiring sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,583 parts In-Stock

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6,583

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VNN

France . 3,779 parts In-Stock

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3,779

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Digiode

USA . 2,690 parts In-Stock

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2,690

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Anansix

USA . 172 parts In-Stock

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172

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 21,061 parts In-Stock

1+ parts

$5.699

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21,061

$5.699

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AZTECH Wire

Italy . 10,046 parts In-Stock

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$6.569

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10,046

$6.569

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One Stop Electronics

USA . 1,358 parts In-Stock

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$7.500

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1,358

$7.500

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Corohmni

South Africa . 142 parts In-Stock

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$9.310

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142

$9.310

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Ampacity Inc.

Singapore . 146 parts In-Stock

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$23.500

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146

$23.500

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Component Stockers USA

USA . 690 parts In-Stock

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$99.990

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690

$99.990

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UNI Independent Distributors

Spain . 8,315 parts In-Stock

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Microchip USA

USA . 5,030 parts In-Stock

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Argo Parts USA

USA . 3,090 parts In-Stock

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Continental Prestige Electronics

USA . 1,676 parts In-Stock

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Supply Digital

USA . 1,533 parts In-Stock

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1,533

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Corphita

USA . 570 parts In-Stock

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570

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Overview

Enhance your electronic applications with the BUK1M200-50SGTD,11 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers exceptional quality and reliability in their products like this Peripheral Driver. With built-in protections against transient, over current, over voltage, and thermal issues, this device ensures optimal performance and peace of mind for users. Whether you're designing automotive electronics, industrial controls, or consumer electronics, the BUK1M200-50SGTD,11 offers unparalleled value, benefits, and advantages that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and impact resistance, making it suitable for long-term use in various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

No. of Functions: 4

With four functions integrated into one component, it offers versatility and efficiency in driving peripheral devices.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections ensure the safety and reliability of connected devices by preventing damage from transient events, overloads, and overheating.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options and flexibility in the wiring configuration of the peripheral driver.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, allowing for compact designs without compromising functionality.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold offers excellent conductivity and corrosion resistance for reliable performance over time.

Maximum Seated Height: 2.65 mm

The low maximum seated height enables a slim profile for the peripheral driver, enhancing compatibility with various electronic devices.

Width: 7.5 mm

The moderate width of 7.5 mm strikes a balance between compactness and ease of handling during installation and maintenance.

Length: 12.8 mm

The length of 12.8 mm provides sufficient space for accommodating all the functions and terminals within the peripheral driver.

Terminal Form: GULL WING

The gull wing terminal form offers secure attachment to the PCB and facilitates efficient soldering for strong electrical connections.

Turn-on Time: 12 us

The fast turn-on time of 12 us ensures quick response and activation of peripheral devices, promoting smooth operation in real-time applications.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm provides a standard spacing for easy integration with common PCB layouts and components.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type offers compatibility with a wide range of devices and systems, enhancing versatility in applications.

Turn-off Time: 65 us

The moderate turn-off time of 65 us ensures proper deactivation of peripheral devices, preventing issues such as overloading or short circuits.

Output Current Flow Direction: SINK

The sink output current flow direction allows for efficient control and management of connected devices, ensuring optimal performance and stability.

Technical Specifications

Peripheral Drivers BUK1M200-50SGTD,11 attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

65 us

Turn-on Time:

12 us

Width:

7.5 mm

Trade Compliance

BUK1M200-50SGTD,11 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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