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BUK1M200-50SGTD,51

NXP Semiconductors

BUK1M200-50SGTD,51 by NXP Semiconductors

NXP Semiconductors' BUK1M200-50SGTD,51 is a Peripheral Driver with 4 functions and built-in protections against transient, over current, over voltage, and thermal issues. This small outline package has 20 terminals in a gull wing form with a turn-on time of 12 us and turn-off time of 65 us. It is ideal for applications requiring buffer or inverter based peripheral drivers with sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,149 parts In-Stock

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5,149

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Digiode

USA . 4,609 parts In-Stock

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4,609

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VNN

France . 3,299 parts In-Stock

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3,299

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Anansix

USA . 903 parts In-Stock

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903

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Corohmni

South Africa . 581 parts In-Stock

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$2.741

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581

$2.741

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AZTECH Wire

Italy . 11,608 parts In-Stock

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$7.175

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$7.175

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Aztec Data Supply Inc.

USA . 2,885 parts In-Stock

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$13.244

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$13.244

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Microchip USA

USA . 225 parts In-Stock

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$13.245

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225

$13.245

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Ampacity Inc.

Singapore . 992 parts In-Stock

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$19.500

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992

$19.500

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One Stop Electronics

USA . 251 parts In-Stock

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$30.500

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251

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UNI Independent Distributors

Spain . 4,603 parts In-Stock

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Continental Prestige Electronics

USA . 3,580 parts In-Stock

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Corphita

USA . 2,861 parts In-Stock

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Argo Parts USA

USA . 1,720 parts In-Stock

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Supply Digital

USA . 1,199 parts In-Stock

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1,199

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance the performance of your electronic devices with the BUK1M200-50SGTD,51 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors ensures top-notch quality and reliability in their products. This peripheral driver is designed to provide built-in protections against transient events, over current, over voltage, and thermal issues, offering peace of mind to customers. With its compact size and efficient functionality, this product is perfect for a wide range of applications, making it a valuable addition to any project. Experience the benefits and advantages of the BUK1M200-50SGTD,51 and take your electronics to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and reliability of the product.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic systems.

No. of Functions: 4

With multiple functions available, this peripheral driver offers versatile functionality for different applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, saving space in electronic devices.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The inclusion of various protections ensures the safety and durability of connected components.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and enables complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this product suitable for compact electronic devices.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit layout and design.

Maximum Seated Height: 2.65 mm

The low seated height makes this product suitable for slim devices and compact spaces.

Width: 7.5 mm

The 7.5mm width allows for easy integration into various electronic systems.

Length: 12.8 mm

The 12.8mm length provides a balance between compactness and functionality.

Terminal Form: GULL WING

The gull wing terminal form facilitates secure soldering and reliable connections.

Turn-on Time: 12 us

The fast turn-on time ensures quick response in activating connected devices.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise connections and compatibility with standard components.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type offers compatibility with different systems and devices.

Turn-off Time: 65 us

The 65us turn-off time ensures efficient deactivation of output signals.

Output Current Flow Direction: SINK

The sink current flow direction enables effective control and regulation of current flow in connected devices.

Technical Specifications

Peripheral Drivers BUK1M200-50SGTD,51 attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

65 us

Turn-on Time:

12 us

Width:

7.5 mm

Trade Compliance

BUK1M200-50SGTD,51 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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