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BSS83,235

NXP Semiconductors

BSS83,235 by NXP Semiconductors

The NXP Semiconductors BSS83,235 is a single N-channel power FET with a max drain current of 0.05A and power dissipation of 0.23W. Operating in enhancement mode, it has a max temperature of 125°C making it suitable for various applications requiring low-power switching capabilities in surface mount configurations.

Median Price

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Lifecycle Status

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1k+

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Vyrian

USA . 8,627 parts In-Stock

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France . 2,113 parts In-Stock

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Anansix

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Digiode

USA . 523 parts In-Stock

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Nova Conductors

Japan . 80 parts In-Stock

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Corohmni

South Africa . 405 parts In-Stock

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$0.310

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Aztec Data Supply Inc.

USA . 3,446 parts In-Stock

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AZTECH Wire

Italy . 291 parts In-Stock

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Ampacity Inc.

Singapore . 545 parts In-Stock

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One Stop Electronics

USA . 526 parts In-Stock

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Spain . 1,972 parts In-Stock

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Microchip USA

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Overview

Discover the power of NXP Semiconductors with the BSS83,235 Power Field Effect Transistor. This high-quality, single-channel FET offers exceptional performance and reliability for a wide range of applications. From enhancing efficiency in power supplies to improving motor control systems, this transistor is the key to unlocking new possibilities. With a maximum drain current of 0.05 A and a maximum power dissipation of 0.23 W, the BSS83,235 delivers unparalleled value and benefits to customers seeking top-notch semiconductor solutions. Choose NXP Semiconductors for cutting-edge technology that pushes the boundaries of innovation.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for low-side switching applications, providing reliable performance and efficient operation.

Configuration: SINGLE

Single configuration simplifies the circuit design and enhances the overall reliability of the product.

Surface Mount: YES

Surface mount capability makes the product suitable for compact and space-constrained applications, improving versatility and ease of use.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures faster response times and better control over the switching action, optimizing performance.

Maximum Drain Current (Abs) (ID): 0.05 A

The maximum drain current of 0.05 A allows the FET to handle moderate power requirements with efficiency and stability.

Maximum Power Dissipation (Abs): 0.23 W

The low maximum power dissipation of 0.23 W ensures that the device operates within safe temperature limits, preventing overheating and prolonging its lifespan.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers reliable performance, low power consumption, and high efficiency, making it a preferred choice for various electronic applications.

Maximum Operating Temperature: 125 °C

The maximum operating temperature of 125°C ensures that the FET can withstand high-temperature environments, enhancing its reliability and longevity.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity, facilitating easy integration into electronic circuits.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds minimizes the risk of thermal damage during soldering, ensuring product integrity.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable and efficient soldering processes, creating strong and durable connections.

Technical Specifications

Power Field Effect Transistors (FET) BSS83,235 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.05 A

Maximum Drain Current (ID):

.05 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

125 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BSS83,235 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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