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BSP220-TAPE-13

NXP Semiconductors

BSP220-TAPE-13 by NXP Semiconductors

BSP220-TAPE-13 from NXP Semiconductors is a small signal FET designed for efficient switching applications. It features a max operating temp of 150 °C, 12Ω max drain-source on resistance, and comes in a compact rectangular package with gull-wing terminals. Ideal for surface mount designs, it ensures reliable performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,090 parts In-Stock

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2,090

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Vyrian

USA . 1,802 parts In-Stock

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1,802

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Digiode

USA . 1,416 parts In-Stock

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1,416

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One Stop Electronics

USA . 744 parts In-Stock

1+ parts

$16.050

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744

$16.050

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UNI Independent Distributors

Spain . 7,577 parts In-Stock

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7,577

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Corphita

USA . 1,249 parts In-Stock

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Northwest PG Solutions

USA . 594 parts In-Stock

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594

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Native Components

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409

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Overview

Elevate your designs with the BSP220-TAPE-13 from NXP Semiconductors, a leading name in innovation and reliability. This small signal FET combines superior performance with robust construction, ensuring exceptional switching capabilities for diverse applications. Its compact surface mount design simplifies integration, while a built-in diode enhances functionality. Trust NXP to deliver quality and efficiency, empowering your projects with unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to moisture, making the product suitable for diverse environments and applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode simplifies circuit design and provides additional protection against voltage spikes.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control the flow of current, enhancing performance in various electronic devices.

Surface Mount: YES

The surface mount feature allows for compact and efficient PCB designs, saving space and reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier placement and soldering on PCBs, improving assembly productivity.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering surface area, ensuring reliable connections and minimizing the risk of mechanical stress.

No. of Terminals: 4

With 4 terminals, this FET allows for versatile connections in circuit design, promoting flexibility and ease of integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, making it a great choice for portable and compact devices.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliable performance in high-temperature environments, making this FET suitable for challenging conditions.

Transistor Element Material: SILICON

Silicon as the element material offers excellent electrical characteristics, making it a standard choice for efficient and reliable FETs.

Maximum Drain-Source On Resistance: 12 ohm

A maximum drain-source on resistance of 12 ohms signifies efficient power handling, reducing energy loss and heat during operation.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and simplifies routing on PCBs, aiding in effective circuit design.

Case Connection: DRAIN

The drain case connection helps in effective heat dissipation, optimizing performance and reliability in applications requiring high current.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSP220-TAPE-13 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

DRAIN

Maximum Drain-Source On Resistance:

12 ohm

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSP220-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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