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BSD22-TAPE-13

NXP Semiconductors

BSD22-TAPE-13 by NXP Semiconductors

BSD22-TAPE-13 from NXP is an N-channel FET designed for switching applications, featuring a max drain current of 0.05 A and a breakdown voltage of 20 V. It operates in depletion mode with a compact SO package and gull-wing terminals. Ideal for surface mount designs, it withstands temps up to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,769 parts In-Stock

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Vyrian

USA . 2,698 parts In-Stock

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Anansix

USA . 743 parts In-Stock

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Native Components

USA . 109 parts In-Stock

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$0.085

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$0.082

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Northwest PG Solutions

USA . 2,355 parts In-Stock

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$0.093

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One Stop Electronics

USA . 1,081 parts In-Stock

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$34.050

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Corphita

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UNI Independent Distributors

Spain . 1,514 parts In-Stock

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Overview

Unlock exceptional performance with the BSD22-TAPE-13 from NXP Semiconductors, a leader in innovative technology. This high-quality N-channel FET is engineered for efficient switching applications, offering remarkable reliability and versatility in compact designs. With its built-in diode and surface mount capability, you'll enjoy a seamless integration into your projects. Elevate your designs with the trusted quality and cutting-edge solutions that NXP delivers, ensuring maximum value and enhanced efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making this transistor reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and better performance in switching applications, making them ideal for modern electronic designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the circuit's protection against reverse currents, ensuring safer operation in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching, this transistor supports fast, efficient operation in a variety of electronic circuits.

Surface Mount: YES

Surface mount capability allows for compact designs and ease of integration on PCB, making it suitable for space-constrained applications.

Minimum DS Breakdown Voltage: 20 V

A minimum breakdown voltage of 20V provides a reliable safety margin for protection in various circuit conditions.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB, allowing for flexible design layouts.

Terminal Form: GULL WING

Gull wing leads facilitate easy soldering and provide robust mechanical performance, ensuring electrical integrity in the assembly.

Operating Mode: DEPLETION MODE

Depletion mode operation typically consumes less power in a static state, contributing to overall energy efficiency in electronic designs.

No. of Terminals: 4

Four terminals enable versatile circuit connections and configurations, enhancing usability across different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style accommodates compact designs, beneficial for portable and space-sensitive devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables lower power consumption and higher switching speeds, making it suitable for advanced electronic applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows this FET to perform reliably in demanding environments, improving overall product robustness.

Transistor Element Material: SILICON

Silicon offers excellent electrical properties and stability, ensuring reliable performance and longevity in electronic devices.

Maximum Drain Current (ID): 0.05 A

A maximum drain current of 0.05A supports a range of low-power applications, making it suitable for both consumer and industrial electronics.

Maximum Drain-Source On Resistance: 50 ohm

A low on-resistance minimizes power losses during operation, improving overall efficiency and heat management in circuits.

Terminal Position: DUAL

Dual terminal positioning enhances mounting flexibility, allowing designers to optimize layout and ease of access.

Case Connection: SUBSTRATE

Substrate connection improves thermal performance and stability, ensuring reliable operation even under high load conditions.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSD22-TAPE-13 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SUBSTRATE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.05 A

Maximum Drain-Source On Resistance:

50 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSD22-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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