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BLF7G24L-140,118

NXP Semiconductors

BLF7G24L-140,118 by NXP Semiconductors

BLF7G24L-140,118 by NXP Semiconductors is an N-channel enhancement mode FET ideal for high-power applications. It supports a max drain current of 28 A and operates up to 200 °C, making it suitable for demanding environments. This transistor excels in RF amplification and switching tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,625 parts In-Stock

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Digiode

USA . 1,647 parts In-Stock

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1,647

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Anansix

USA . 1,126 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 881 parts In-Stock

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$0.962

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881

$0.962

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Northwest PG Solutions

USA . 834 parts In-Stock

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$1.058

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834

$1.058

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$2.257

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$2.054

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$1.851

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350

$2.257

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$1.851

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One Stop Electronics

USA . 859 parts In-Stock

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$12.050

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859

$12.050

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AZTECH Wire

Italy . 636 parts In-Stock

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$19.590

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636

$19.590

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UNI Independent Distributors

Spain . 6,031 parts In-Stock

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Corphita

USA . 4,461 parts In-Stock

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Overview

Unlock unparalleled performance with the BLF7G24L-140,118 from NXP Semiconductors, a trusted leader in innovation. This robust N-channel power FET delivers exceptional efficiency and reliability, making it ideal for demanding applications like RF amplification and industrial automation. Experience enhanced thermal stability and impressive current handling that propel your designs forward, ensuring top-notch quality and performance you can count on. Transform your projects today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower ON resistance and higher current capacity, making them ideal for high-efficiency applications.

Configuration: SINGLE

A single configuration provides simpler designs and reduces potential points of failure in applications where a single FET suffices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control and higher performance in switching applications compared to depletion mode.

Maximum Drain Current (Abs): 28 A

A maximum drain current of 28A allows for robust performance in power applications, supporting a wide range of load requirements.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and fast switching speeds, making these transistors versatile and efficient for various applications.

Maximum Operating Temperature: 200 °C

With a maximum operating temperature of 200 °C, this FET can withstand harsh environments and maintain performance under extreme conditions.

Maximum Drain Current (ID): 28 A

This repeated specification emphasizes the ability to handle high currents, ensuring reliability in demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) BLF7G24L-140,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

28 A

Maximum Drain Current (ID):

28 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Trade Compliance

BLF7G24L-140,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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