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BLD6G22L-50,112

NXP Semiconductors

BLD6G22L-50,112 by NXP Semiconductors

BLD6G22L-50,112 by NXP Semiconductors is an N-channel MOSFET designed for efficient power management. It supports a max drain current of 10.2 A and operates at temperatures up to 200 °C, making it ideal for high-performance applications in electronics. Its surface mount configuration ensures easy integration into compact designs.

Median Price

$73.440

Lifecycle Status

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1k+

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Rochester

USA . 20 parts In-Stock

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$73.440

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$65.710

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$61.840

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Digiode

USA . 1,766 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 950 parts In-Stock

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Ampacity Inc.

Singapore . 20 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Overview

Unlock superior performance with the BLD6G22L-50,112 N-Channel Power FET from NXP Semiconductors. Renowned for their quality and innovation, NXP ensures this device delivers exceptional efficiency and reliability, ideal for demanding applications in automotive and industrial sectors. With its robust design and impressive thermal capabilities, this FET empowers your projects to thrive under pressure, providing unmatched value and reliability that you can trust.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically faster and have lower on-resistance, making them ideal for high-efficiency applications.

Configuration: SINGLE

A single configuration simplifies circuit design and is suitable for various applications, promoting versatility.

Surface Mount: YES

Surface mount technology (SMT) allows for easier assembly and a smaller footprint, making it suitable for compact designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control over current flow, enabling more precise applications.

Maximum Drain Current (Abs) (ID): 10.2 A

A maximum drain current of 10.2 A allows for powering a variety of loads, ensuring high-performance in demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making it an energy-efficient choice for modern electronics.

Maximum Operating Temperature: 200 °C

A high maximum operating temperature of 200 °C ensures reliability in extreme conditions, suitable for industrial environments.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand long reflow times enhances compatibility with various soldering processes, aiding in manufacturing flexibility.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C meets industry standards, ensuring compatibility with high-temperature soldering techniques.

Technical Specifications

Power Field Effect Transistors (FET) BLD6G22L-50,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

10.2 A

Maximum Drain Current (ID):

10.2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BLD6G22L-50,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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