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BLA1011-200

NXP Semiconductors

BLA1011-200 by NXP Semiconductors

The NXP Semiconductors BLA1011-200 is a single N-channel RF Power FET with a 75V DS breakdown voltage, ideal for amplifier applications in the L band. Featuring a ceramic and metal-sealed co-fired package, it operates in enhancement mode with a max power dissipation of 700W at 200°C.

Median Price

$390.295

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,994 parts In-Stock

1+ parts

$346.930

100+ parts

$326.110

1k+ parts

$305.300

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1,994

$346.930

$326.110

$305.300

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DigiKey

USA . 1,994 parts In-Stock

1+ parts

$433.660

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1,994

$433.660

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Distributors (In-Stock)

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Digiode

USA . 4,421 parts In-Stock

1+ parts

$383.638

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4,421

$383.638

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Vyrian

USA . 3,397 parts In-Stock

1+ parts

$403.830

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3,397

$403.830

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Anansix

USA . 148 parts In-Stock

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148

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Distributors (Availability)

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Native Components

USA . 71 parts In-Stock

1+ parts

$18.790

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71

$18.790

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Northwest PG Solutions

USA . 130 parts In-Stock

1+ parts

$20.669

100+ parts

$18.602

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130

$20.669

$18.602

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Corphita

USA . 4,468 parts In-Stock

1+ parts

$363.447

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4,468

$363.447

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Component Stockers USA

USA . 1,439 parts In-Stock

1+ parts

$408.890

100+ parts

$388.050

1k+ parts

$350.900

10k+ parts

-

1,439

$408.890

$388.050

$350.900

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Microchip USA

USA . 6,739 parts In-Stock

1+ parts

$581.475

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6,739

$581.475

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A-Z Elektronik GmbH

Germany . 6,036 parts In-Stock

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6,036

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UNI Independent Distributors

Spain . 4,051 parts In-Stock

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4,051

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Alle Elektronik GmbH

Germany . 4,024 parts In-Stock

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4,024

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Perfect Parts

USA . 125 parts In-Stock

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Overview

Unleash the power of innovative RF technology with the BLA1011-200 by NXP Semiconductors. Designed for high-performance applications, this single-channel amplifier offers exceptional quality and reliability. Whether you're in the aerospace, defense, or telecommunications industry, this FET transistor in ceramic-metal-sealed co-fired packaging is sure to elevate your projects to new heights. Experience the value and benefits of the BLA1011-200 and take your designs to the next level with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides high durability and reliability, making the RF Power FET suitable for long-term use in various environments.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors offer high mobility and faster switching speeds, providing efficient performance in amplification applications.

Configuration: SINGLE

The single configuration simplifies the design and integration process, making it easier to incorporate the RF Power FET into electronic circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and signal amplification.

Surface Mount: YES

Surface mount compatibility allows for easy and efficient assembly onto circuit boards, saving space and reducing installation time.

Minimum DS Breakdown Voltage: 75 V

A minimum breakdown voltage of 75V ensures reliable operation and protection against voltage spikes in power applications.

Package Shape: RECTANGULAR

The rectangular package shape offers easy mounting and alignment on circuit boards for seamless integration into electronic systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology provides efficient and reliable switching characteristics, ensuring high performance in RF power applications.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature of 200°C, this RF Power FET can withstand elevated temperatures, suitable for demanding applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in connecting the RF Power FET to external circuitry, enabling versatile integration options.

Technical Specifications

RF Power Field Effect Transistors (FET) BLA1011-200 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

75 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-CDFM-F2

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLA1011-200 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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