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BAS70-06T/R

NXP Semiconductors

BAS70-06T/R by NXP Semiconductors

MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Connector Distribution Corp

USA . 38,990 parts In-Stock

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38,990

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Right Parts Inc.

USA . 38,990 parts In-Stock

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38,990

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Digiode

USA . 3,260 parts In-Stock

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3,260

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Anansix

USA . 2,181 parts In-Stock

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2,181

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Inventory MP

USA . 2,148 parts In-Stock

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2,148

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Bristol Electronics

USA . 2,148 parts In-Stock

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PC Components Company LLC

USA . 1,400 parts In-Stock

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1,400

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Prism Electronics

USA . 691 parts In-Stock

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Vyrian

USA . 373 parts In-Stock

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373

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Distributors (Availability)

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Native Components

USA . 435 parts In-Stock

1+ parts

$0.068

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$0.065

435

$0.068

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$0.065

Northwest PG Solutions

USA . 387 parts In-Stock

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$0.075

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$0.066

387

$0.075

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$0.066

One Stop Electronics

USA . 1,084 parts In-Stock

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$2.010

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1,084

$2.010

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UNI Independent Distributors

Spain . 6,081 parts In-Stock

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Corphita

USA . 2,078 parts In-Stock

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2,078

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Perfect Parts

USA . 702 parts In-Stock

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702

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Technical Specifications

Microwave Mixer & Detector Diodes BAS70-06T/R attributes and parameters. Explore more Microwave Mixer & Detector Diodes devices from NXP Semiconductors

Specs

Config:

COMMON ANODE, 2 ELEMENTS

Maximum Diode Capacitance:

2 pF

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.41 V

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Maximum Non Repetitive Peak Forward Current:

.1 A

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

.07 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

70 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

BAS70-06T/R Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.60

SB

8541.10.00.60

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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