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BAS70-07

NXP Semiconductors

BAS70-07 by NXP Semiconductors

MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 4; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (In-Stock)

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Elcom Components

USA . 616,760 parts In-Stock

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Chip Stock

USA . 355,500 parts In-Stock

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EMSNET

USA . 42,870 parts In-Stock

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Prism Electronics

USA . 8,930 parts In-Stock

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Classic Components Corporation

USA . 7,565 parts In-Stock

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Digiode

USA . 5,488 parts In-Stock

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Rebound Electronics

UK . 5,375 parts In-Stock

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Vyrian

USA . 3,573 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 3,381 parts In-Stock

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Anansix

USA . 3,147 parts In-Stock

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LWI Electronics Inc

India . 2,990 parts In-Stock

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Bristol Electronics

USA . 2,985 parts In-Stock

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Connector Distribution Corp

USA . 2,600 parts In-Stock

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Right Parts Inc.

USA . 2,600 parts In-Stock

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Goldney Electronics S.L.

Spain . 2,219 parts In-Stock

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Pegasus Components GmbH

Germany . 2,200 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,920 parts In-Stock

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ComSIT USA

USA . 1,920 parts In-Stock

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J2 Sourcing AB

Sweden . 920 parts In-Stock

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Executive Electronics, Inc.

USA . 720 parts In-Stock

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Microfarads

USA . 228 parts In-Stock

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Cyclops Electronics Ltd

UK . 224 parts In-Stock

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ECAB

Sweden . 84 parts In-Stock

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Bas Electronics GmbH & Co. KG

Germany . 80 parts In-Stock

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80

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,208 parts In-Stock

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$0.032

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MKK Technologies

India . 2,204 parts In-Stock

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$0.061

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DigiPath Technology Company

USA . 2,204 parts In-Stock

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$0.061

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Modulus Dynamics

Lithuania . 24,473 parts In-Stock

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$0.085

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$0.082

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$0.078

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One Stop Electronics

USA . 1,010 parts In-Stock

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AZTECH Wire

Italy . 2,572 parts In-Stock

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Kepictronics

USA . 138,813 parts In-Stock

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Perfect Parts

USA . 28,448 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 12,330 parts In-Stock

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Assy Fe

Spain . 6,195 parts In-Stock

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Corphita

USA . 5,505 parts In-Stock

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Supply Digital

USA . 2,591 parts In-Stock

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Northwest PG Solutions

USA . 2,462 parts In-Stock

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Native Components

USA . 2,357 parts In-Stock

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UNI Independent Distributors

Spain . 1,832 parts In-Stock

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Parana Technologies

USA . 1,788 parts In-Stock

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$0.038

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Alle Elektronik GmbH

Germany . 1,605 parts In-Stock

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S.R.D Solutions

India . 1,000 parts In-Stock

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Technical Specifications

Microwave Mixer & Detector Diodes BAS70-07 attributes and parameters. Explore more Microwave Mixer & Detector Diodes devices from NXP Semiconductors

Specs

Case Connection:

CATHODE

Config:

SEPARATE, 2 ELEMENTS

Maximum Diode Capacitance:

2 pF

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.41 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

70 V

Maximum Reverse Current:

.1 uA

Reverse Test Voltage:

50 V

Sub-Category:

Other Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BAS70-07 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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