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BAP70AM,135

NXP Semiconductors

BAP70AM,135 by NXP Semiconductors

PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 6; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

$0.290

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$0.301

1k+ parts

$0.249

10k+ parts

$0.222

10,000

-

$0.301

$0.249

$0.222

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.278

10,000

-

-

-

$0.278

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,215 parts In-Stock

1+ parts

$0.234

100+ parts

-

1k+ parts

-

10k+ parts

-

2,215

$0.234

-

-

-

Vyrian

USA . 8,489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,489

-

-

-

-

Anansix

USA . 1,793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,793

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,024 parts In-Stock

1+ parts

$0.221

100+ parts

-

1k+ parts

-

10k+ parts

-

4,024

$0.221

-

-

-

Component Stockers USA

USA . 14,042 parts In-Stock

1+ parts

$0.280

100+ parts

$0.260

1k+ parts

$0.240

10k+ parts

$0.240

14,042

$0.280

$0.260

$0.240

$0.240

Microchip USA

USA . 429 parts In-Stock

1+ parts

$1.820

100+ parts

-

1k+ parts

-

10k+ parts

-

429

$1.820

-

-

-

Northwest PG Solutions

USA . 250 parts In-Stock

1+ parts

$3.180

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$3.180

-

-

-

AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$8.940

100+ parts

-

1k+ parts

-

10k+ parts

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283

$8.940

-

-

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UNI Independent Distributors

Spain . 6,917 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,917

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-

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Native Components

USA . 637 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.804

10k+ parts

-

637

-

-

$2.804

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Technical Specifications

PIN Diodes BAP70AM,135 attributes and parameters. Explore more PIN Diodes devices from NXP Semiconductors

Specs

Additional Features:

LOW DISTORTION

Application:

ATTENUATOR

Config:

2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Maximum Diode Capacitance:

.25 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

1.9 ohm

Diode Type:

Maximum Forward Voltage (VF):

1.1 V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Nominal Minority Carrier Lifetime:

1.25 us

Moisture Sensitivity Level (MSL):

1

No. of Elements:

4

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.3 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

50 V

Maximum Reverse Current:

.1 uA

Reverse Test Voltage:

50 V

Sub-Category:

Other Diodes

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BAP70AM,135 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00

SB

8541.10.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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