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74LVTH32245EC,551

NXP Semiconductors

74LVTH32245EC,551 by NXP Semiconductors

BUS TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

Median Price

$7.210

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 25 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

25

$1.320

-

-

-

Rochester

USA . 10,648 parts In-Stock

1+ parts

-

100+ parts

$7.210

1k+ parts

$6.450

10k+ parts

$6.070

10,648

-

$7.210

$6.450

$6.070

Verical

USA . 6,808 parts In-Stock

1+ parts

-

100+ parts

$9.012

1k+ parts

$8.063

10k+ parts

$7.588

6,808

-

$9.012

$8.063

$7.588

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,900 parts In-Stock

1+ parts

$1.226

100+ parts

-

1k+ parts

-

10k+ parts

-

3,900

$1.226

-

-

-

Vyrian

USA . 2,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,218

-

-

-

-

Anansix

USA . 1,227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,227

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,554 parts In-Stock

1+ parts

$1.161

100+ parts

-

1k+ parts

-

10k+ parts

-

2,554

$1.161

-

-

-

Andel Nordic

Denmark . 93 parts In-Stock

1+ parts

$10.310

100+ parts

-

1k+ parts

$9.898

10k+ parts

$9.898

93

$10.310

-

$9.898

$9.898

Native Components

USA . 979 parts In-Stock

1+ parts

$10.945

100+ parts

-

1k+ parts

-

10k+ parts

-

979

$10.945

-

-

-

Northwest PG Solutions

USA . 2,198 parts In-Stock

1+ parts

$12.039

100+ parts

$10.836

1k+ parts

-

10k+ parts

-

2,198

$12.039

$10.836

-

-

Microchip USA

USA . 125 parts In-Stock

1+ parts

$16.550

100+ parts

-

1k+ parts

-

10k+ parts

-

125

$16.550

-

-

-

AZTECH Wire

Italy . 1,151 parts In-Stock

1+ parts

$19.680

100+ parts

-

1k+ parts

-

10k+ parts

-

1,151

$19.680

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,908 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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15,908

-

-

-

-

UNI Independent Distributors

Spain . 1,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,275

-

-

-

-

Technical Specifications

Bus Driver & Transceivers 74LVTH32245EC,551 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

4

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.3 ns

Propagation Delay (tpd):

3.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.5 mm

Trade Compliance

74LVTH32245EC,551 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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