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74LVT574PW,112

NXP Semiconductors

74LVT574PW,112 by NXP Semiconductors

NXP Semiconductors' 74LVT574PW,112 is an 8-bit bus driver with a propagation delay of 5.9 ns at 3.3V supply voltage. It features a small outline package, operates b/w -40 to 85°C, and supports up to 150MHz frequency. Ideal for industrial applications requiring true output polarity and positive edge triggering in a compact design.

Median Price

$0.420

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,403 parts In-Stock

1+ parts

-

100+ parts

$0.412

1k+ parts

$0.342

10k+ parts

$0.305

4,403

-

$0.412

$0.342

$0.305

Verical

USA . 4,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.428

10k+ parts

$0.381

4,403

-

-

$0.428

$0.381

Distributors (In-Stock)

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Digiode

USA . 3,288 parts In-Stock

1+ parts

$0.164

100+ parts

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3,288

$0.164

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Vyrian

USA . 5,189 parts In-Stock

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5,189

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Anansix

USA . 1,348 parts In-Stock

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1,348

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Semi Source

USA . 23 parts In-Stock

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23

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,141 parts In-Stock

1+ parts

$0.147

100+ parts

-

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4,141

$0.147

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Corphita

USA . 1,298 parts In-Stock

1+ parts

$0.156

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$0.156

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Native Components

USA . 590 parts In-Stock

1+ parts

$0.356

100+ parts

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$0.342

590

$0.356

-

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$0.342

Northwest PG Solutions

USA . 87 parts In-Stock

1+ parts

$0.392

100+ parts

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$0.345

87

$0.392

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$0.345

Microchip USA

USA . 186 parts In-Stock

1+ parts

$1.870

100+ parts

$1.870

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$1.870

10k+ parts

$1.870

186

$1.870

$1.870

$1.870

$1.870

Andel Nordic

Denmark . 5,846 parts In-Stock

1+ parts

$9.914

100+ parts

-

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$9.518

10k+ parts

$9.518

5,846

$9.914

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$9.518

$9.518

AZTECH Wire

Italy . 936 parts In-Stock

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$14.640

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936

$14.640

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UNI Independent Distributors

Spain . 4,688 parts In-Stock

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Continental Prestige Electronics

USA . 4,403 parts In-Stock

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$0.208

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4,403

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Perfect Parts

USA . 2,092 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality 74LVT574PW,112 bus driver & transceiver from NXP Semiconductors. Offering reliable performance and versatility, this product is ideal for a variety of applications. With its advanced technology and industrial-grade construction, you can trust in the value and benefits that this component brings to your projects. Upgrade your circuits today with the NXP Semiconductors 74LVT574PW,112 for enhanced efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 5.9 ns

Low propagation delay ensures quick data transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard supply voltage, making it compatible with a wide range of systems.

Output Characteristics: 3-STATE

The 3-state output allows the transceiver to have high impedance when disabled, preventing signal interference in multi-drop bus systems.

Maximum Frequency At Nominal Supply: 150000000 Hz

Supports high-frequency operation, making it suitable for applications requiring fast data transfer rates.

Terminal Pitch: 0.65 mm

The small terminal pitch enables compact design and integration into densely populated PCBs.

Technical Specifications

Bus Driver & Transceivers 74LVT574PW,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

BROADSIDE VERSION OF 374

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

12 mA

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74LVT574PW,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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