Loading...

74LVCH32373AEC,551

NXP Semiconductors

74LVCH32373AEC,551 by NXP Semiconductors

NXP Semiconductors' 74LVCH32373AEC,551 is an 8-bit bus driver with a propagation delay of 5.9 ns at 3.3V supply voltage. It features a low profile grid array package and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring fast signal transmission and high reliability in harsh environments.

Median Price

$8.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 788 parts In-Stock

1+ parts

-

100+ parts

$4.910

1k+ parts

-

10k+ parts

-

788

-

$4.910

-

-

Rochester

USA . 743 parts In-Stock

1+ parts

-

100+ parts

$8.270

1k+ parts

$7.400

10k+ parts

$6.960

743

-

$8.270

$7.400

$6.960

Verical

USA . 743 parts In-Stock

1+ parts

-

100+ parts

$10.338

1k+ parts

$9.250

10k+ parts

$8.700

743

-

$10.338

$9.250

$8.700

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,555 parts In-Stock

1+ parts

$4.484

100+ parts

-

1k+ parts

-

10k+ parts

-

2,555

$4.484

-

-

-

Vyrian

USA . 3,561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,561

-

-

-

-

Anansix

USA . 941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

941

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 618 parts In-Stock

1+ parts

$0.470

100+ parts

-

1k+ parts

-

10k+ parts

$0.451

618

$0.470

-

-

$0.451

Northwest PG Solutions

USA . 1,247 parts In-Stock

1+ parts

$0.517

100+ parts

-

1k+ parts

-

10k+ parts

$0.456

1,247

$0.517

-

-

$0.456

Ampacity Inc.

Singapore . 352 parts In-Stock

1+ parts

$4.010

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$4.010

-

-

-

Corphita

USA . 4,108 parts In-Stock

1+ parts

$4.248

100+ parts

-

1k+ parts

-

10k+ parts

-

4,108

$4.248

-

-

-

Component Stockers USA

USA . 922 parts In-Stock

1+ parts

$4.840

100+ parts

$4.550

1k+ parts

-

10k+ parts

-

922

$4.840

$4.550

-

-

Andel Nordic

Denmark . 1,975 parts In-Stock

1+ parts

$5.063

100+ parts

-

1k+ parts

$4.861

10k+ parts

$4.861

1,975

$5.063

-

$4.861

$4.861

Microchip USA

USA . 279 parts In-Stock

1+ parts

$17.180

100+ parts

$17.180

1k+ parts

$17.180

10k+ parts

$17.180

279

$17.180

$17.180

$17.180

$17.180

UNI Independent Distributors

Spain . 3,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,393

-

-

-

-

Continental Prestige Electronics

USA . 788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

788

-

-

-

-

Overview

Experience seamless data transmission with the 74LVCH32373AEC,551 by NXP Semiconductors. This high-quality bus driver & transceiver offers reliable performance and fast propagation delay, making it ideal for various industrial applications. With its compact design and low power consumption, this product provides exceptional value and efficiency to customers looking for top-notch connectivity solutions. Upgrade your systems today with NXP Semiconductors' innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for cost-effective product design.

Propagation Delay At Nominal Supply: 5.9 ns

Fast signal propagation ensures efficient communication in bus driver applications.

Surface Mount: YES

Ease of installation and space-saving design.

No. of Functions: 4

Ability to handle multiple functions effectively in bus driver and transceiver operations.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common and stable voltage for compatibility with various systems.

Load Capacitance (CL): 50 pF

Optimized for driving loads in bus communication networks.

Output Characteristics: 3-STATE

Allows for high impedance state when not driving the bus for efficient signal transmission.

Technical Specifications

Bus Driver & Transceivers 74LVCH32373AEC,551 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

4

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

5.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.5 mm

Trade Compliance

74LVCH32373AEC,551 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20