Loading...

74LVCH32245AEC,557

NXP Semiconductors

74LVCH32245AEC,557 by NXP Semiconductors

NXP Semiconductors' 74LVCH32245AEC,557 is an 8-bit bus driver with a propagation delay of 4.5 ns at Vsup of 2.7V and operates in industrial temperatures (-40 to 85°C). It features a low profile grid array package suitable for bidirectional applications requiring common control.

Median Price

$6.986

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,172 parts In-Stock

1+ parts

-

100+ parts

$6.210

1k+ parts

$5.560

10k+ parts

$5.230

20,172

-

$6.210

$5.560

$5.230

Verical

USA . 19,461 parts In-Stock

1+ parts

-

100+ parts

$7.763

1k+ parts

$6.950

10k+ parts

$6.537

19,461

-

$7.763

$6.950

$6.537

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,778 parts In-Stock

1+ parts

$3.363

100+ parts

-

1k+ parts

-

10k+ parts

-

4,778

$3.363

-

-

-

Vyrian

USA . 4,726 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,726

-

-

-

-

Anansix

USA . 2,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,232

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,797 parts In-Stock

1+ parts

$3.186

100+ parts

-

1k+ parts

-

10k+ parts

-

4,797

$3.186

-

-

-

Andel Nordic

Denmark . 5,762 parts In-Stock

1+ parts

$9.462

100+ parts

-

1k+ parts

$9.083

10k+ parts

$9.083

5,762

$9.462

-

$9.083

$9.083

Microchip USA

USA . 237 parts In-Stock

1+ parts

$15.860

100+ parts

$15.860

1k+ parts

$15.860

10k+ parts

$15.860

237

$15.860

$15.860

$15.860

$15.860

AZTECH Wire

Italy . 444 parts In-Stock

1+ parts

$17.270

100+ parts

-

1k+ parts

-

10k+ parts

-

444

$17.270

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29,176

-

-

-

-

UNI Independent Distributors

Spain . 2,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,518

-

-

-

-

Northwest PG Solutions

USA . 758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

758

-

-

-

-

Native Components

USA . 335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

335

-

-

-

-

Perfect Parts

USA . 112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

112

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Enhance your electronic designs with the 74LVCH32245AEC,557 from NXP Semiconductors. This high-quality Bus Driver & Transceiver offers 3-STATE output characteristics, a propagation delay of 4.5 ns, and a maximum seated height of only 1.5 mm. Perfect for industrial applications, this versatile component features common control and bidirectional count direction, making it a valuable addition to any project. Trust NXP Semiconductors for reliable performance and innovative technology in every product. Elevate your designs with the 74LVCH32245AEC,557 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in a variety of environments.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay ensures fast data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable reduces the footprint of the product on the PCB and simplifies the assembly process.

No. of Functions: 4

Having multiple functions in a single component increases efficiency and reduces the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape allows for easy and space-efficient placement on the PCB.

No. of Bits: 8

8 bits allow for a wide range of data transmission capabilities, suitable for various applications.

Nominal Supply Voltage / Vsup (V): 2.7

Optimal supply voltage ensures stable operation and efficient power usage.

Power Supplies (V): 3.3

The standard power supply voltage of 3.3V makes it compatible with a wide range of systems.

No. of Terminals: 96

Having a high number of terminals allows for versatile connectivity options.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offer space-saving benefits and ease of integration in compact designs.

Maximum I (ol): 24 Amp

High maximum output current capability makes this product suitable for driving demanding loads.

Propagation Delay (tpd): 4.7 ns

Low propagation delay ensures minimal signal distortion and reliable data transmission.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in harsh environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for flexible control over the bus lines, enhancing the versatility of the product.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures makes this product suitable for a variety of applications.

Terminal Finish: Tin/Lead (Sn63Pb37)

Tin/lead terminal finish provides good solderability and reliability in the assembly process.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and routing of traces.

No. of Ports: 2

Having dual ports allows for versatile connectivity options and increased flexibility in data transmission.

Maximum Seated Height: 1.5 mm

Low profile design with a maximum seated height of 1.5mm saves space on the PCB.

Width: 5.5 mm

Compact width dimension allows for efficient space utilization on the PCB.

Output Polarity: TRUE

True output polarity ensures accurate data transmission without signal inversion.

Minimum Supply Voltage (Vsup): 1.2 V

Low minimum supply voltage requirement enables operation in low-power scenarios.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time at peak temperature ensures reliable solder joints during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the product can withstand the assembly process.

Length: 13.5 mm

Compact length dimension saves space on the PCB and allows for dense routing of traces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form facilitates easy and reliable soldering during the assembly process.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for high-density mounting on the PCB.

Count Direction: BIDIRECTIONAL

Bidirectional count direction allows for versatile communication capabilities.

Control Type: COMMON CONTROL

Common control type simplifies the interface design and operation of the product.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates the product is suitable for standard moisture exposure levels during storage and assembly.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage tolerance provides operational flexibility and protection against voltage spikes.

Technical Specifications

Bus Driver & Transceivers 74LVCH32245AEC,557 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

4

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

4.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.5 mm

Trade Compliance

74LVCH32245AEC,557 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20