Loading...

74LVC623ADB-Q100J

NXP Semiconductors

74LVC623ADB-Q100J by NXP Semiconductors

74LVC623ADB-Q100J by NXP is an 8-bit bus driver with a propagation delay of just 6.5 ns, ideal for automotive applications. It operates at a nominal voltage of 3.3V and supports bidirectional data flow. With AEC-Q100 screening, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,640

-

-

-

-

Digiode

USA . 4,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,101

-

-

-

-

Anansix

USA . 2,427 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,427

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,565 parts In-Stock

1+ parts

$3.123

100+ parts

-

1k+ parts

-

10k+ parts

-

1,565

$3.123

-

-

-

Andel Nordic

Denmark . 5,330 parts In-Stock

1+ parts

$8.934

100+ parts

-

1k+ parts

$8.577

10k+ parts

$8.577

5,330

$8.934

-

$8.577

$8.577

AZTECH Wire

Italy . 645 parts In-Stock

1+ parts

$12.840

100+ parts

-

1k+ parts

-

10k+ parts

-

645

$12.840

-

-

-

Microchip USA

USA . 151 parts In-Stock

1+ parts

$31.102

100+ parts

-

1k+ parts

-

10k+ parts

-

151

$31.102

-

-

-

One Stop Electronics

USA . 519 parts In-Stock

1+ parts

$48.000

100+ parts

-

1k+ parts

-

10k+ parts

-

519

$48.000

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29,048

-

-

-

-

UNI Independent Distributors

Spain . 4,833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,833

-

-

-

-

Corphita

USA . 4,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,305

-

-

-

-

Native Components

USA . 829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.754

10k+ parts

-

829

-

-

$2.754

-

Overview

Elevate your designs with the 74LVC623ADB-Q100J from NXP Semiconductors, a trusted leader in innovation. This high-quality bus driver and transceiver delivers exceptional performance with lightning-fast propagation delays and robust automotive-grade reliability. Perfect for automotive and industrial applications, it ensures seamless data transmission while saving power. Experience unparalleled durability and efficiency—transforming your projects into high-performance solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making the product reliable for automotive applications.

Propagation Delay At Nominal Supply: 6.5 ns

A low propagation delay of 6.5 ns indicates high-speed data transmission capabilities, which is essential for efficient communication in bus driver applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and automated assembly processes, reducing overall manufacturing costs and enabling space-saving designs.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the product meets stringent automotive quality standards, making it suitable for use in automotive electronics.

Package Shape: RECTANGULAR

A rectangular package shape is optimized for efficient PCB layout design, allowing easy integration into various circuit configurations.

No. of Bits: 8

An 8-bit configuration makes this product versatile for various digital applications, enabling adequate data handling for a wide range of signals.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V is ideal for modern low-power applications, ensuring energy efficiency in device operation.

Power Supplies (V): 3.3

Supporting a 3.3V power supply is compatible with many contemporary digital systems, enhancing system interoperability.

No. of Terminals: 20

With 20 terminals, this device provides ample connectivity options for buses, enhancing its flexibility in various system designs.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline, shrink pitch design reduces the footprint on the PCB, facilitating compact device designs and higher component densities.

Maximum I (ol): 24 Amp

A maximum output current capability of 24 Amps ensures that the device can handle substantial load conditions, suitable for robust applications.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125 °C makes this product suitable for high-temperature environments, enhancing reliability in extreme conditions.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for flexible control of bus lines, making it efficient in multi-device communication scenarios.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows the device to function in harsh, cold environments, ensuring reliability in various climates.

Terminal Position: DUAL

Dual terminal positions provide additional layout flexibility, making integration into different circuit designs easier.

Output Polarity: TRUE

True output polarity ensures compatibility with standard logic levels found in most digital systems, allowing for straightforward integration.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this temperature grade guarantees reliability under automotive conditions, meeting industry demands for performance.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated and sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and improves mechanical strength, enhancing the reliability of connections on PCB assembly.

Packing Method: TR

Tape and reel packing method facilitates automated assembly, speeding up production while maintaining component integrity during transport.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for denser layouts while remaining compatible with standard PCB fabrication processes.

Count Direction: BIDIRECTIONAL

The bidirectional count direction is ideal for applications needing two-way communication, enhancing flexibility in data transfer.

Control Type: INDEPENDENT CONTROL

Independent control enables individual management of each channel, providing enhanced control and efficiency in multi-channel systems.

Technical Specifications

Bus Driver & Transceivers 74LVC623ADB-Q100J attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

JESD-30 Code:

R-PDSO-G20

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

74LVC623ADB-Q100J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20